登录新浪财经APP 搜索【信披】查看更多考评等级 证券代码：600460 证券简称：士兰微 编号：临2025-057 杭州士兰微电子股份有限公司对外投资进展公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述或者重大遗漏，并对其内容 的真实性、准确性和完整性承担法律责任。 一、对外投资概述 杭州士兰微电子股份有限公司（以下简称"公司"或"本公司"）于2025年10月18日与厦门市人民政府、厦 门市海沧区人民政府签署了《12英寸高端模拟集成电路芯片制造生产线项目战略合作协议》（以下简 称"《战略合作协议》"）。同时，为落实前述《战略合作协议》，公司、公司全资子公司厦门士兰微电 子有限公司与厦门半导体投资集团有限公司、厦门新翼科技实业有限公司签署了《12英寸高端模拟集成 电路芯片制造生产线项目之投资合作协议》（以下简称"《投资合作协议》"）。 2025年12月17日 根据《战略合作协议》和《投资合作协议》，各方合作在厦门市海沧区合资经营项目公司"厦门士兰集 华微电子有限公司（以下简称 "士兰集华"）"，作为"12英寸高端模拟集成电路芯片制造生产线项目"的 实施主体，建设一条12英寸集成电路芯片 ...

Core Viewpoint - Company plans to invest 20 billion yuan in a joint venture with Xiamen government to establish a 12-inch integrated circuit chip manufacturing line focused on high-end analog chips [1][3][4] Investment Plan - Total planned investment for the project is 20 billion yuan, with a capacity of 45,000 wafers per month, implemented in two phases [1][4] - Phase one involves an investment of 10 billion yuan, with the company contributing 1.51 billion yuan [1][4] - The project aims to enhance the domestic production rate of high-end analog chips, which is currently below 15% [1][3] Financial Performance - In the first half of 2025, the company achieved a net profit of 265 million yuan, a year-on-year increase of 1162.42% [2][9] - The company has consistently increased its R&D investment over the past five years, reaching 523 million yuan in the first half of 2025 [9] Strategic Collaboration - The joint venture, named Xiamen Silan Jihua Microelectronics Co., Ltd., will be the implementation entity for the project [3][4] - The company will reduce its ownership stake in the joint venture from 100% to 29.55%, with Xiamen Semiconductor and New Wing Technology holding 41.1% [4][6] Market Outlook - The high-end analog chip market has significant growth potential due to increasing demand from industries such as electric vehicles, large computing servers, and robotics [3][4] - The project is expected to enhance the company's international competitiveness and accelerate the domestic substitution of high-end analog chips [4][9] Technological Transition - The company has transitioned from being a power semiconductor leader to a comprehensive semiconductor product supplier, expanding its capabilities in various technology areas [7][8] - The investment will further solidify the company's strategic layout in the high-end analog integrated circuit chip sector [9]

Core Viewpoint - The strategic cooperation agreement between Silan Microelectronics and the Xiamen government marks a significant investment in the semiconductor industry, with a total investment of 20 billion yuan to establish a 12-inch high-end analog integrated circuit chip manufacturing line, aimed at addressing the domestic shortage of key chips in various sectors [2][4]. Investment Details - The project will be executed in two phases, with the first phase involving an investment of 10 billion yuan, expected to commence by the end of 2025 and achieve production by the fourth quarter of 2027, ultimately reaching an annual production capacity of 240,000 chips [2][5]. - The second phase will also involve an additional investment of 10 billion yuan, increasing the monthly production capacity to 45,000 chips and an annual capacity of 540,000 chips [2][5]. Market Context - The domestic market for high-end analog chips currently has a low localization rate, heavily relying on imports, indicating significant growth potential for domestic production [2][4]. - The project is expected to alleviate supply pressure on core components in emerging industries such as new energy vehicles, AI, and industrial robotics, thereby promoting the localization process [4][6]. Financial Structure - The funding for the first phase includes 6.01 billion yuan in capital, with Xiamen state-owned assets contributing 3.6 billion yuan, accounting for over 60% of the total [3]. - Silan Microelectronics and its subsidiaries will contribute 1.5 billion yuan, with the remaining funds to be supplemented by future investors, supported by a special loan from the National Development Bank [3]. Industry Impact - The establishment of the production line is anticipated to create a significant industrial chain effect, attracting upstream and downstream enterprises to Xiamen and fostering a complete high-end chip industry ecosystem [3][4]. - Silan Microelectronics plans to leverage its expertise in technology and talent management to support the industry chain and enhance Xiamen's semiconductor innovation development [4][6]. Previous Collaborations - Silan Microelectronics has a history of collaboration with the Xiamen government, having previously signed an agreement to build an 8-inch SiC power device chip manufacturing line, which is also progressing towards production [6].

Core Viewpoint - The semiconductor industry is set to welcome a significant investment project worth 20 billion RMB, focusing on the construction of a 12-inch high-end analog integrated circuit chip manufacturing line in Xiamen, China [1][2]. Group 1: Project Overview - The project involves a total planned investment of 20 billion RMB, to be executed in two phases: the first phase will invest 10 billion RMB, aiming to start construction by the end of 2025 and achieve initial production by Q4 2027, with full production expected by 2030, reaching an annual capacity of 240,000 12-inch analog integrated circuit chips [1][2][4]. - The project is positioned in the high-end analog chip sector, characterized by high technical barriers, complex designs, and stringent performance, reliability, and power consumption requirements [2]. Group 2: Financial Structure - The first phase's investment of 10 billion RMB will be financed through 6.01 billion RMB in equity (60.1%) and 3.99 billion RMB in bank loans (39.9%) [2]. - The second phase will also involve an additional investment of 10 billion RMB, which will increase the monthly production capacity by 25,000 chips, leading to a total monthly capacity of 45,000 chips and an annual output of 540,000 chips [2]. Group 3: Strategic Importance - The project aims to accelerate the localization of high-end analog chips in China, addressing the current low domestic market penetration, particularly in high-end segments, and enhancing the company's international competitiveness [2][3]. - The company plans to leverage its advantages in integrated circuits, power semiconductors, and MEMS sensor production lines, along with the favorable policies and environment in Xiamen, to support upstream and downstream enterprises in the industry chain [3]. Group 4: Previous Collaborations - Prior to this project, the company had collaborated with the Xiamen government on a 12 billion RMB project to build an 8-inch SiC power device chip manufacturing line, which is also progressing well with expected production commencement in Q4 of this year [6].

Core Viewpoint - Company signed a strategic cooperation agreement with Xiamen Municipal Government for a high-end analog integrated circuit chip manufacturing project, indicating a significant investment in semiconductor production [1][2]. Group 1: Project Overview - The project focuses on high-end analog integrated circuit chips with a total planned investment of 20 billion yuan [2]. - The planned production capacity is 45,000 wafers per month, aiming for an annual output of 540,000 wafers after completion of both phases [2]. Group 2: Investment Details - The company’s wholly-owned subsidiary, Xiamen Silan Micro, will collaborate with Xiamen Semiconductor Investment Group and Xiamen New Wing Technology to increase capital by 5.1 billion yuan [1]. - The investment cooperation agreement was signed to support the development of the 12-inch high-end analog integrated circuit chip manufacturing line [1].

Group 1 - Company Silan Microelectronics plans to invest 20 billion yuan in the construction of a 12-inch high-end analog integrated circuit chip manufacturing production line project, with a total planned capacity of 45000 wafers per month [1] - The project will be implemented in two phases, aiming to achieve an annual production capacity of 540000 wafers after completion [1] Group 2 - Nvidia CEO Jensen Huang will attend the APEC Business Leaders Summit in South Korea and is expected to meet with executives from Samsung and SK Hynix to discuss high bandwidth memory supply and AI collaboration opportunities [2] - Huang stated that Nvidia's market share in high-end chips in China has dropped from 95% to 0% due to U.S. export controls, and he hopes to return to the Chinese market [3] Group 3 - China's meteorological sounding system has upgraded to the Beidou sounding system, achieving over 99% accuracy in atmospheric observation data, marking a significant advancement in high-altitude meteorological observation [6] - The Beidou sounding system has established 353 receiving stations nationwide, with 131 sounding stations accounting for 12% of the global total [6] Group 4 - The user base for generative AI in China reached 515 million by June 2025, with a penetration rate of 36.5%, showing significant growth in the user demographic [7] - Over 90% of users prefer domestic AI models, and China leads the world in AI patent applications, accounting for 38.58% of the global total [7] Group 5 - Cambrian Technology reported a third-quarter revenue of 1.727 billion yuan, a year-on-year increase of 1332.52%, and a net profit of 567 million yuan [8] - The company’s revenue for the first three quarters reached 4.607 billion yuan, with a year-on-year growth of 2386.38% [8] Group 6 - GoerTek announced the termination of a planned acquisition of Mega Precision Technology and Channel Well Industrial for approximately 10.4 billion HKD due to a lack of agreement on key terms [9] - The termination was mutually agreed upon and will not adversely affect the company's financial performance [9] Group 7 - Amsung Electronics signed a strategic cooperation agreement with Sichuan Development Leading Capital to promote high-quality development in aerospace and satellite industries [10] - The collaboration aims to optimize market strategies and explore new opportunities in various sectors, including communication navigation and satellite internet [10] Group 8 - Hanwei Technology plans to acquire a 25.699% stake in Chongqing Stabao for approximately 27.98 million yuan and will also invest 18 million yuan for further capital increase [11] - After the transaction, Hanwei will hold 35.39% of Stabao, which has established the first domestic production line for 10 million film platinum temperature-sensitive chips annually [12] Group 9 - Jingwei Technology intends to acquire 100% of Zhongxing System for 850 million yuan, entering the private network communication field [13] - The acquisition is expected to create significant synergies with Jingwei's recent strategic layout in the semiconductor sector [13] Group 10 - Yitian Intelligent has established a fund that has acquired 77.4% of a company specializing in AI computing power services, with related orders amounting to 10-11 billion yuan [14] - The fund's total size is 2 billion yuan, with Yitian and its affiliates contributing 998 million yuan [14] Group 11 - Hikvision reported a 14.94% year-on-year increase in net profit for the first three quarters, reaching 9.319 billion yuan, with total revenue of 65.758 billion yuan [15] - The third-quarter revenue was 23.94 billion yuan, reflecting a 0.66% year-on-year growth [15] Group 12 - Jingjia Micro signed a strategic cooperation agreement with Jilin University Zhengyuan to develop integration solutions for its GPU products [16] - The collaboration will focus on optimizing compatibility and computing power scheduling for security and virtualization products [16] Group 13 - Yongmota signed a strategic cooperation framework agreement with a leading humanoid robot company to jointly develop cost-effective intelligent robot actuators and joint components [17] - The agreement aims to leverage both parties' strengths to explore deeper collaboration in the robotics field [17]

Core Viewpoint - Silan Microelectronics (士兰微) and its subsidiaries are investing a total of 51 billion yuan in Xiamen Silan Jihua Microelectronics Co., Ltd. to advance the construction of a 12-inch high-end analog integrated circuit chip manufacturing line project, with a total planned investment of 200 billion yuan for the project [1][2][4]. Investment Details - The investment will be made in collaboration with Xiamen Semiconductor Investment Group and Xiamen New Wing Technology Industrial Co., Ltd. Silan Microelectronics will contribute 15 billion yuan, while the total registered capital of Silan Jihua will increase from 1 million yuan to 51.1 billion yuan after the capital increase [1][2][5]. - The project will be implemented in two phases, with the first phase requiring an investment of 100 billion yuan, including 60.1 billion yuan in equity and 39.9 billion yuan in bank loans, aiming for a monthly production capacity of 20,000 wafers [2][4][5]. Project Capacity and Timeline - Upon completion of both phases, the project is expected to achieve a total monthly production capacity of 45,000 wafers (540,000 wafers annually), with the first phase projected to commence production in Q4 2027 [2][4][5]. - The project targets high-end analog integrated circuit chips, focusing on emerging industries such as new energy vehicles, computing servers, and robotics, addressing critical chip shortages in these sectors [2][4]. Strategic Partnerships - The investment is part of a broader strategic cooperation agreement with the Xiamen municipal government and aims to deepen the industrial ties between Silan Microelectronics and Xiamen, following a previous investment plan of 12 billion yuan for an 8-inch SiC power device chip production line [4][5]. - The collaboration is expected to accelerate the aggregation of the semiconductor industry chain in Xiamen and contribute to the establishment of an international high-end chip industry ecosystem [4].

Core Viewpoint - The company, Silan Microelectronics, has signed a strategic cooperation agreement with the Xiamen Municipal Government to enhance its semiconductor industry chain layout, focusing on the construction of a 12-inch integrated circuit chip manufacturing line [1][3]. Investment Details - The total planned investment for the 12-inch chip project is 20 billion yuan, with a production capacity of 45,000 wafers per month, implemented in two phases [1]. - Phase one involves an investment of 10 billion yuan, with 6.01 billion yuan as equity and 3.99 billion yuan from bank loans, aiming for a monthly production capacity of 20,000 wafers [1]. - Phase two will also require an investment of 10 billion yuan, which will increase the monthly production capacity by an additional 25,000 wafers, reaching a total annual production of 540,000 wafers [1]. Company Structure and Capital Increase - Silan Jihua, established in June this year, is wholly owned by Silan Microelectronics and will see an increase in registered capital by 5.1 billion yuan, with contributions from Silan Microelectronics, Xiamen Silan, Xiamen Semiconductor, and New Wing Technology [2]. - After the capital increase, Silan Microelectronics' shareholding will be 25.12%, while Xiamen Semiconductor and New Wing Technology will hold 24.96% and 34.94%, respectively [2]. Strategic Importance - The investment is expected to provide financial support for the construction and operation of the 12-inch chip project, enhancing the company's strategic positioning in the high-end analog integrated circuit chip sector [3]. - The company aims to leverage opportunities in emerging industries such as new energy vehicles, computing servers, and robotics to drive continuous growth in its main business [3].

Core Viewpoint - Company plans to invest in a "12-inch high-end analog integrated circuit chip manufacturing production line project" to enhance its competitiveness in the high-end analog chip sector, driven by the rapid growth of industries such as electric vehicles and large-scale computing servers [1][3]. Investment Project Overview - The total planned investment for the project is 20 billion yuan, with a production capacity of 45,000 wafers per month, implemented in two phases [4]. - Phase one involves an investment of 10 billion yuan, with a capacity of 20,000 wafers per month upon completion [4]. - Phase two will also require an investment of 10 billion yuan, adding an additional capacity of 25,000 wafers per month, leading to a total capacity of 45,000 wafers per month (540,000 wafers annually) [4]. Financial Structure - The capital for phase one is 6.01 billion yuan, with 3.99 billion yuan financed through bank loans [4]. - The new registered capital for the joint venture "Xiamen Silan Jihua Microelectronics Co., Ltd." will increase from 0.01 billion yuan to 5.11 billion yuan after the capital increase [6]. - The funding sources for the company and its subsidiary are from their own funds, not from raised capital [6]. Strategic Partnerships - Company has signed a strategic cooperation agreement with the Xiamen Municipal Government and the Haicang District Government to enhance its semiconductor industry chain layout [3]. - Investment cooperation agreements have been signed with Xiamen Semiconductor Investment Group and Xiamen New Wing Technology Industrial Co., Ltd. [3]. Company Background - Silan Microelectronics was established in September 1997 and is headquartered in Hangzhou, specializing in integrated circuit chip design and semiconductor microelectronics production [8]. - The company was the first integrated circuit chip design enterprise to be listed on the Shanghai Stock Exchange in March 2003 [8]. - Silan Microelectronics maintains a leading position in various technology fields, including green power chip technology and MEMS sensor technology [8]. Market Performance - On October 17, the company's stock closed at 29.94 yuan per share, experiencing a decline of 5.34%, with a market capitalization of nearly 50 billion yuan [9].

Core Viewpoint - Company Silan Microelectronics (士兰微) plans to invest in a 12-inch high-end analog chip manufacturing line with a total investment of 20 billion yuan to enhance its position in the semiconductor industry [1][4]. Investment Agreement - Silan Microelectronics signed a strategic cooperation agreement with the Xiamen Municipal Government and other parties on October 18, 2025, to establish a joint venture for the project [1][4]. - The project will be implemented through a joint venture company named Silan Jihua, focusing on high-end analog integrated circuit chips [4]. Project Details - The total planned investment for the project is 20 billion yuan, with a planned capacity of 45,000 wafers per month, to be executed in two phases [4]. - Phase one will require an investment of 10 billion yuan, with a monthly production capacity of 20,000 wafers upon completion [5]. - Phase two will also require an investment of 10 billion yuan, adding an additional capacity of 25,000 wafers per month, leading to a total annual production of 540,000 wafers after both phases are completed [5]. Financial Contributions - The registered capital for the first phase is set at 6.01 billion yuan, with contributions from Silan Microelectronics, Xiamen Silan Microelectronics, Xiamen Semiconductor Investment Group, and Xiamen New Wing Technology totaling 5.1 billion yuan [5]. - The remaining 900 million yuan of the first phase's capital will be contributed by other investors in the future [5]. Market Performance - Silan Microelectronics reported a revenue of 6.336 billion yuan in the first half of the year, a year-on-year increase of 20.14%, and a net profit of 265 million yuan, marking a significant turnaround with a growth of 1162.42% [6]. - The company's stock price has seen fluctuations, with a recent high of 34.21 yuan per share on October 13, followed by a drop to 29.94 yuan per share on October 17, resulting in a market capitalization of 49.8 billion yuan [6][7].