Core Points - The "2025 Super Node Data Center Industry Summit and High-Density Data Center Developer Forum" will be held from November 26-28 in Hangzhou, Zhejiang, focusing on topics such as super node data center architecture design, interconnection technology, optical module packaging trends, liquid cooling technology, and high thermal conductivity materials [2] - The forum is organized by Cheqian Information and Thermal Design Network, expecting over 40 speakers and 500 industry experts to attend [2] - The event will feature a main conference and two specialized sessions for in-depth discussions [2] Group 1: Main Conference Topics - Core technologies and challenges of super node data centers will be discussed, including new product releases from companies like H3C Group and Intel [3][14] - A key presentation will cover ultra-high-density AI cluster liquid cooling technologies by Sugon Data Infrastructure Innovation Technology [3][14] - Innovations in AI chip interconnection protocols and the evolution of super node optical interconnection will be presented by China Mobile Communication Group Design Institute [4][14] Group 2: Specialized Session 1 - Optical Interconnection and Module Technology - Discussions will include topics from companies like Zhongji Xuchuang and Fenghuo Communication Technology on optical interconnection and module technologies [5][6] - The session will also cover the opportunities and challenges posed by AI computing on optical interconnection by HiSilicon [5][16] - Presentations will address the trends and opportunities in super node optical interconnection technology by H3C Technology and Fudan University [5][16] Group 3: Specialized Session 2 - Chip-Server-Data Center Thermal Management Technology - Key topics will include GPU packaging heat dissipation and interconnection technologies, with insights from Advanced Electronic Materials International Innovation Research Institute [16] - The session will also explore the thermal challenges and countermeasures for high-speed optical modules in the AI era by Harman (China) Investment [6][16] - Liquid cooling solutions and AI energy-saving technologies will be discussed by Fenghuo Communication Technology [21]