Core Viewpoint - The company is focusing on launching advanced panel-level packaging equipment, including three new products aimed at enhancing manufacturing efficiency and reducing contamination risks in the semiconductor industry [1] Product Innovations - The UltraECPap-p panel-level electroplating equipment utilizes a patented horizontal electroplating method that synchronizes the square electric field with the panel, improving electroplating uniformity and reducing chemical cross-contamination risks between different metal plating baths [1] - The UltraCvac-p panel-level negative pressure cleaning equipment employs negative pressure technology to remove flux residues from chip structures, significantly enhancing cleaning efficiency by allowing cleaning solutions to reach narrow gaps; this equipment is already in mass production at client sites [1] - The UltraCbev-p panel-level edge etching equipment is designed specifically for edge etching and copper residue removal, playing a crucial role in fan-out panel-level packaging technology [1] Market Strategy - The company aims to actively promote the application and expansion of these three product types in the Taiwan market, while also focusing on the development trends in the panel-level equipment market [1] - The company expresses confidence in opening up the wafer-level packaging equipment market in Taiwan this year [1]

Core Viewpoint - The company is focusing on the launch of three new panel-level advanced packaging equipment, which are expected to enhance production efficiency and reduce contamination risks in the manufacturing process [1][2]. Group 1: New Products - The company is introducing three new products: Ultra ECP ap-p panel-level electroplating equipment, Ultra C vac-p panel-level negative pressure cleaning equipment, and Ultra C bev-p panel-level edge etching equipment [1]. - The Ultra ECP ap-p equipment utilizes a patented horizontal electroplating method that synchronizes the square electric field with the panel, improving electroplating uniformity and reducing chemical cross-contamination risks [1]. - The Ultra C vac-p equipment employs negative pressure technology to remove flux residues from chip structures, significantly enhancing cleaning efficiency and has already achieved mass production at client sites [1]. - The Ultra C bev-p equipment is designed specifically for edge etching and copper residue removal, playing a crucial role in fan-out panel-level packaging technology [1]. Group 2: Market Expansion - The company plans to actively promote the application and expansion of these three product types in the Taiwan market [2]. - The company aims to capitalize on the development trends in the panel-level equipment market and is committed to developing fully wet-process panel equipment [2]. - The company expresses confidence in entering the wafer-level packaging equipment market in Taiwan this year [2].

Core Viewpoint - The company is focusing on the launch of three new panel-level advanced packaging equipment, which are expected to enhance production efficiency and reduce contamination risks in the manufacturing process [1][2]. Group 1: New Products - The company is introducing three new products: Ultra ECP ap-p panel-level electroplating equipment, Ultra C vac-p panel-level negative pressure cleaning equipment, and Ultra C bev-p panel-level edge etching equipment [1]. - The Ultra ECP ap-p equipment utilizes a patented horizontal electroplating method that synchronizes the square electric field with the panel, improving electroplating uniformity and reducing chemical cross-contamination risks [1]. - The Ultra C vac-p equipment employs negative pressure technology to remove flux residues from chip structures, significantly enhancing cleaning efficiency and has already achieved mass production at client sites [1]. - The Ultra C bev-p equipment is designed specifically for edge etching and copper residue removal, playing a crucial role in fan-out panel-level packaging technology [1]. Group 2: Market Expansion - The company plans to actively promote the application and expansion of these three product types in the Taiwan market [2]. - The company aims to capitalize on the development trends in the panel-level equipment market and is focusing on fully wet process panel equipment types [2]. - The company expresses confidence in entering the wafer-level packaging equipment market in Taiwan this year [2].