Group 1 - The China-Europe semiconductor industry meeting held on May 27 emphasized deepening economic and trade cooperation in the semiconductor sector and maintaining global supply chain stability [1] - Japan proposed to purchase U.S. semiconductor products worth several billion dollars as part of U.S.-Japan tariff negotiations, according to a report by Asahi Shimbun on May 28 [1] - In Q1 2025, the semiconductor industry showed typical seasonality with electronic product sales declining by 16% quarter-on-quarter but remaining flat year-on-year; IC sales decreased by 2% quarter-on-quarter but increased by 23% year-on-year, indicating ongoing investment in AI and high-performance computing infrastructure [1] Group 2 - Semiconductor capital expenditures (CapEx) decreased by 7% quarter-on-quarter but increased by 27% year-on-year, with manufacturers increasing investments in advanced logic, HBM, and advanced packaging [1] - Memory-related CapEx surged by 57% year-on-year, while non-memory CapEx grew by 15%; wafer fab equipment (WFE) spending increased by 19% year-on-year, and test equipment orders rose by 56% [1] - HBM4 technology costs are expected to exceed a 30% premium due to increased I/O counts and the adoption of logic chip architectures [1]