Group 1 - The global semiconductor industry is expected to grow from $631 billion in 2024 to over $1 trillion by 2030, with a CAGR of approximately 8%, driven mainly by AI and HPC [1] - SEMI forecasts a 10% year-on-year increase in global WFE capital expenditure in 2026, accelerating from 6% in 2025, reflecting strong growth in advanced process logic and memory capital expenditures driven by AI [1] - Advanced packaging has become a hot topic in the industry, with Nvidia indicating that the number of transistors required for current AI chips far exceeds the single-chip limit, making advanced packaging technology crucial for overcoming computing power bottlenecks [1] Group 2 - The integrated circuit ETF (159546) tracks the integrated circuit index (932087), which primarily covers listed companies in semiconductor design, manufacturing, packaging testing, and related materials and equipment, selecting companies with high growth potential and strong technological innovation to reflect the overall performance and development trends of China's integrated circuit industry [1]

Group 1 - The China-Europe semiconductor industry meeting held on May 27 emphasized deepening economic and trade cooperation in the semiconductor sector and maintaining global supply chain stability [1] - Japan proposed to purchase U.S. semiconductor products worth several billion dollars as part of U.S.-Japan tariff negotiations, according to a report by Asahi Shimbun on May 28 [1] - In Q1 2025, the semiconductor industry showed typical seasonality with electronic product sales declining by 16% quarter-on-quarter but remaining flat year-on-year; IC sales decreased by 2% quarter-on-quarter but increased by 23% year-on-year, indicating ongoing investment in AI and high-performance computing infrastructure [1] Group 2 - Semiconductor capital expenditures (CapEx) decreased by 7% quarter-on-quarter but increased by 27% year-on-year, with manufacturers increasing investments in advanced logic, HBM, and advanced packaging [1] - Memory-related CapEx surged by 57% year-on-year, while non-memory CapEx grew by 15%; wafer fab equipment (WFE) spending increased by 19% year-on-year, and test equipment orders rose by 56% [1] - HBM4 technology costs are expected to exceed a 30% premium due to increased I/O counts and the adoption of logic chip architectures [1]