Core Viewpoint - Silan Microelectronics (士兰微) and its subsidiaries are investing a total of 51 billion yuan in Xiamen Silan Jihua Microelectronics Co., Ltd. to advance the construction of a 12-inch high-end analog integrated circuit chip manufacturing line project, with a total planned investment of 200 billion yuan for the project [1][2][4]. Investment Details - The investment will be made in collaboration with Xiamen Semiconductor Investment Group and Xiamen New Wing Technology Industrial Co., Ltd. Silan Microelectronics will contribute 15 billion yuan, while the total registered capital of Silan Jihua will increase from 1 million yuan to 51.1 billion yuan after the capital increase [1][2][5]. - The project will be implemented in two phases, with the first phase requiring an investment of 100 billion yuan, including 60.1 billion yuan in equity and 39.9 billion yuan in bank loans, aiming for a monthly production capacity of 20,000 wafers [2][4][5]. Project Capacity and Timeline - Upon completion of both phases, the project is expected to achieve a total monthly production capacity of 45,000 wafers (540,000 wafers annually), with the first phase projected to commence production in Q4 2027 [2][4][5]. - The project targets high-end analog integrated circuit chips, focusing on emerging industries such as new energy vehicles, computing servers, and robotics, addressing critical chip shortages in these sectors [2][4]. Strategic Partnerships - The investment is part of a broader strategic cooperation agreement with the Xiamen municipal government and aims to deepen the industrial ties between Silan Microelectronics and Xiamen, following a previous investment plan of 12 billion yuan for an 8-inch SiC power device chip production line [4][5]. - The collaboration is expected to accelerate the aggregation of the semiconductor industry chain in Xiamen and contribute to the establishment of an international high-end chip industry ecosystem [4].