Core Viewpoint - The company, Chongda Technology, has signed an investment agreement for a new IC packaging substrate project in Kunshan, Jiangsu, with a total investment of 1 billion yuan [1] Group 1: Project Details - The project will focus on the production of integrated circuit packaging substrates for high-end applications, including end-side chips [1] - The investment will cover the construction of production facilities, R&D facilities, and supporting infrastructure [1] - The project is scheduled to have land available by May 2026, commence construction in September 2026, and be completed by September 2028 [1] Group 2: Strategic Goals - The project aims to expand the company's production capacity and technological advantages in the high-end IC substrate sector [1] - It seeks to optimize the product structure and enhance competitiveness and market share in the critical segments of the semiconductor packaging industry [1]

Core Viewpoint - The company, Chongda Technology, is expanding its capabilities in the high-end integrated circuit (IC) packaging substrate sector through a significant investment project in Kunshan, Jiangsu Province, aimed at enhancing its competitive edge and market share in the semiconductor packaging industry [1] Group 1: Project Details - Chongda Technology's subsidiary, Jiangsu Punowei Electronics Co., Ltd., has signed an investment agreement with the government of Kunshan, committing to a total investment of 1 billion yuan for the "End-side Functional IC Packaging Substrate Project" [1] - The project will establish a production base for IC packaging substrates used in high-end applications, including production facilities, research and development infrastructure, and supporting facilities [1] - The project is scheduled to have land available by May 2026, commence construction in September 2026, and be completed and operational by September 2028 [1] Group 2: Strategic Objectives - The initiative aims to expand the company's production capacity and technological advantages in the high-end IC substrate field [1] - The project is expected to optimize the product structure and enhance competitiveness in critical segments of the semiconductor packaging supply chain [1] - The investment is anticipated to increase the company's market share in the semiconductor packaging industry [1]