Core Viewpoint - The company has advanced capabilities in producing high-layer count PCBs, specifically mentioning the GB300 model which features a 40-layer backplane architecture and a Compute Tray with 22-layer HDI technology [1] Group 1 - The GB300 model utilizes a three-piece PCB design, evolving the layer count from 24 to 40 layers, with 38 layers employing PTFE hybrid technology [1] - The company confirms its ability to mass-produce 40-layer high multilayer boards and has capabilities for 5th generation and above HDI sample production [1] - The company is committed to keeping pace with cutting-edge technology development to meet high-end market demands [1]