Core Insights - Suzhou Tianzhun Technology Co., Ltd. celebrated its 20th anniversary with a summit attended by notable figures from academia, government, and industry, focusing on the integration of AI and industrial practices [1][4] - The company has established a dual-core architecture consisting of a "Visual Precision Drive Control Platform" and an "AI Technology Platform," aiming to overcome key technological challenges and break foreign monopolies [1][4] - Tianzhun Technology has expanded its business into global markets, serving over 6,000 clients across sectors such as electronics, semiconductors, new energy vehicles, and robotics since its successful IPO in 2019 [1][4] Fundraising and Educational Initiatives - During the summit, the "Meidao Fund" was launched, initiated by key figures including Shen Xiangyang and Xu Yihua, with a total value of approximately 450 million yuan, aimed at supporting AI talent development and educational initiatives in Suzhou [1][4] - The fund consists of 8 million yuan in cash and 8 million shares of Tianzhun Technology, highlighting the company's commitment to fostering a positive cycle of education, technology, and talent [1][4] Technological Advancements - Tianzhun Technology showcased its core technology layout, emphasizing an "AI measurement detection" foundation that integrates precision sensing and intelligent decision-making, particularly in cutting-edge fields like electronics and semiconductors [4] - The company introduced the "Star Intelligence 007" controller, enhancing computational power to support complex models in embodied intelligence scenarios, in collaboration with NVIDIA's Jetson platform [4] - Looking ahead, the company plans to focus on "AI + Industry," advancing technological breakthroughs, market positioning, and ecosystem development to deepen AI applications in relevant industrial sectors [4]

Group 1: Event Overview - The 2025 China International Industrial Fair (CIIF 2025) will be held from September 23 to 27 at the National Exhibition and Convention Center in Shanghai, covering an exhibition area of 300,000 square meters and attracting over 3,000 exhibitors, including nearly 300 from the Fortune Global 500 and industry leaders [1] - This year's fair will showcase thousands of new products and technologies, marking the largest scale in history [1] Group 2: AI and Industrial Integration - The deep integration of AI and industrial automation is the core theme of this year's fair, with major companies like ABB, Schneider Electric, Siemens, and others presenting advanced solutions [2][1] - New thematic areas have been established, including "AI + Industrial Mother Machine," integrated circuit, nuclear power technology, and innovation incubation, aiming to create a "4S store" for Chinese industry [3] Group 3: Company Highlights - ABB will showcase dozens of cutting-edge products and system solutions in motion control, robotics, and mechanical automation, emphasizing autonomous multifunctional robots and dynamic path tracking solutions [5][8] - Schneider Electric will present software-defined automation solutions and energy management integration, demonstrating AI-enhanced solutions for various sectors [8][9] - New松 will highlight its AI welding system, which significantly improves welding efficiency and quality through AI visual technology and motion control algorithms [11] - Siemens will display over 180 products and solutions, including the upgraded "Drilling Heart 2.0" product matrix and AI-related innovations across the entire industrial value chain [12] Group 4: Innovative Products - Shanghai Electric will present a model of a green methanol integrated project, showcasing advanced technologies for converting agricultural waste into green methanol [16] - Shanghai Fanuc will unveil the R-50iA series robot control cabinet and the CRX series collaborative robots, designed for various industrial applications [17][14] - The "Thinking Source Intelligent Control" machine tool μAI will be launched, featuring autonomous path generation and self-evolution capabilities [19]