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芯片的“打磨师傅”:CMP
半导体芯闻· 2025-08-04 10:37
Core Viewpoint - CMP (Chemical Mechanical Polishing) is a crucial process in semiconductor manufacturing that ensures the smoothness of wafer surfaces, enabling the successful fabrication of advanced chips [2][4]. Group 1: CMP Process Overview - CMP plays a vital role in various stages of chip manufacturing, including the planarization of insulating layers, metal layers, and transitions between multiple layers [4]. - The process involves placing the wafer on a polishing pad, where a specialized slurry is applied to achieve a smooth surface through chemical reactions and mechanical polishing [2][4]. Group 2: Importance of Slurry - The quality of the slurry is essential for achieving a smooth wafer surface, with different types of slurries used based on the wafer material and desired planarization effect [4]. - Major suppliers of high-end CMP slurries include companies like Cabot Microelectronics, DuPont, Fujimi, and Showa Denko, indicating a reliance on international firms for these critical materials [4]. Group 3: Types of Abrasives - Abrasives in CMP slurries can be categorized into three main types: silica-based, alumina-based, and ceria-based, each with distinct properties affecting the polishing process [5][6]. - The shape and hardness of these abrasives influence the material removal selectivity, impacting the overall polishing precision and surface quality [6]. Group 4: Challenges and Innovations - CMP faces challenges such as the risk of damaging circuits through excessive polishing or insufficient planarization, especially as manufacturing processes advance to the nanoscale [6]. - The industry is actively developing gentler slurries, new polishing pads, and AI monitoring systems to enhance the precision and stability of the CMP process, adapting to future manufacturing needs [6].