Core Viewpoint - The "2025 Second High-Performance Chip Developer Forum and Chip Thermal Management Technology Exchange Conference" will be held on May 22-23 in Beijing, focusing on various aspects of domestic AI chip development and technology [1] Group 1: Conference Details - The forum will cover topics such as domestic AI chip progress, AI chip security, Chiplet technology, advanced packaging materials, thermal design for AI chips, direct cooling technology, and 3DVC uniform temperature technology [1] - Over 20 presentations are scheduled, with an expected attendance of more than 300 industry experts [1] Group 2: Participation and Services - Attendees will receive learning opportunities, including post-conference materials and access to a dedicated community [1] - Exhibition services include booth display, three attendee passes, printed conference materials, public account promotion, and video interviews [1] - Speaking opportunities include a 30-minute presentation in a specialized session, three attendee passes, printed conference materials, and public account promotion [1]