Key Takeaways MRVL is deploying modular RDL interposer tech to build larger, high-efficiency AI accelerator solutions. The design supports HBM3/3E integration, enables die replacement, and enhances power and latency performance. MRVL sees a $94B data center chip market by 2028, with custom compute offerings witnessing a 53% CAGR.Marvell Technology (MRVL) uses advanced CMOS technologies at 5nm and 3nm nodes and is now shifting toward 2nm and below, which include innovations like gate-all-around transistors ...

更多资料加入知识星球：水木调研纪要 关注公众号：水木Alpha J P M O R G A N Asia Pacific Equity Research 26 June 2025 TSMC See page 10 for analyst certification and important disclosures, including non-US analyst disclosures. Advanced Packaging update – Adjusting CoWoS and raising WMCM estimates In this update, we separate out CoWoS and WMCM forecasts, as WMCM expectations are starting to rise materially for 2026 and 2027. Please see our wafer- level forecast, chip-level shipments by XPU and capacity assumptions in Tables 1-2, Table 3 ...

Equity Research 25 June 2025 U.S. Semiconductors & Semiconductor Capital Equipment Laying Out the Scale-Up Architecture Landscape Interconnect is more critical than ever for the success of XPU efforts, and this is no more prevalent than in scale-up designs where dominance is being fought today amongst three factions (UALink, Scale Up Ethernet, NVLink) with major implications for the future of AI. We appreciate your 5-star vote in the 2025 Extel All-America Research Survey in the Semiconductors & Semiconduct ...

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