Core Viewpoint - NVIDIA has initiated the design plan for its own HBM (High Bandwidth Memory) Base Die, which is expected to start small-scale trial production in the second half of 2027, potentially reshaping the competitive landscape of the next-generation HBM market [2][3]. Group 1: NVIDIA's Strategy - NVIDIA's move to self-design the HBM Base Die aims to provide customers with more modular options on its NVLink Fusion open architecture platform, thereby enhancing its ecosystem control [3]. - The design process will utilize a 3nm process node, which is anticipated to impact the HBM ecosystem significantly [2]. Group 2: Market Dynamics - Currently, SK Hynix holds the highest market share in HBM, primarily using its own design solutions for HBM Base Die [2]. - SK Hynix has announced the provision of new 12-layer HBM4 samples to major clients, featuring a capacity of 36GB and a bandwidth exceeding 2TB per second, representing over a 60% increase compared to the previous generation HBM3E [3]. Group 3: Technical Challenges - The integration of UCIe high-speed interfaces for communication with GPUs and CPUs will significantly increase the design complexity of the Base Die [2]. - ASIC companies like Creative already possess complete IP and design platforms, which may provide an advantage in the evolving HBM landscape [2].