Core Viewpoint - The company expects a significant increase in orders for its peelable copper products within the next 1-2 years, driven by advancements in AI technology and trends in advanced packaging solutions [1] Group 1: Company Insights - The company specializes in peelable ultra-thin copper foil, primarily used in the production of IC substrates and similar substrates [1] - Continuous communication with customers has led to improvements in product quality and yield, allowing the company to overcome initial challenges in product development [1] Group 2: Industry Trends - The demand for peelable copper products is anticipated to grow rapidly due to the fast development of AI technology and the adoption of advanced packaging routes such as CoWoP [1] - The increasing use of SLP-type substrates in 800G/1.6T optical modules is expected to further drive the demand for these products [1]

Group 1 - The company, Aisen Co., Ltd. (688720.SH), has indicated on its interactive platform that its products are applicable in CoWoP advanced packaging, with specific requirements depending on the corresponding technical route [1]