Core Viewpoint - The company has relevant products and technology reserves for HBM (High Bandwidth Memory) storage chip packaging, including advanced packaging photoresists and various chemical solutions [1] Group 1 - The company offers "advanced packaging photoresists," "electroplating copper base liquids," "copper-titanium etching liquids," and "tin-silver electroplating additives" that can be utilized in HBM storage chip packaging [1]