先进封装光刻胶
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艾森股份:公司多产品可用于HBM存储芯片封装
Xin Lang Cai Jing· 2025-10-30 08:57
董秘回答(艾森股份SH688720): 投资者提问: 你好,贵司有HBM 高带宽存储芯片 制程相关的产品或者技术储备吗 尊敬的投资者您好,公司"先进封装光刻胶""电镀铜基液""铜钛蚀刻液""电镀锡银添加剂"等产品可以用 于HBM存储芯片封装。感谢您的关注。查看更多董秘问答>> 免责声明:本信息由新浪财经从公开信息中摘录,不构成任何投资建议;新浪财经不保证数据的准确 性,内容仅供参考。 ...
艾森股份股价下跌4.44% 半导体封装领域获机构密集调研
Jin Rong Jie· 2025-08-25 18:16
Core Viewpoint - As of August 25, 2025, Aisen Co., Ltd. experienced a stock price decline of 4.44%, closing at 50.15 yuan, with a trading volume of 67,323 hands and a transaction amount of 344 million yuan [1] Group 1: Company Overview - Aisen Co., Ltd. is a leading supplier in the domestic semiconductor packaging sector and plays a significant role in advanced wafer processing [1] - The company possesses Turnkey capabilities in the electroplating solution field, covering wafer manufacturing from 5nm to 14nm [1] - In the advanced packaging photoresist sector, Aisen is a key supplier and the only domestic company to break the monopoly of Japan's JSR [1] Group 2: Recent Developments - On August 25, the company announced that it received multiple institutional research visits, including from Invesco Great Wall Fund, on August 22 [1] - During the research visit, the management highlighted the operational performance for the first half of 2025, focusing on its technological advantages and market position in semiconductor packaging and wafer manufacturing [1] - Over the past year, Aisen has hosted 154 research visits from 126 institutions [1]