Core Viewpoint - The company, Helin Weina, is engaged in the semiconductor chip testing probe industry, focusing on high-end process chip testing, particularly for high pin count, high current, and high frequency characteristics [1] Group 1 - The company has been asked by investors about its application in HBM (High Bandwidth Memory) chip production processes [1] - Helin Weina confirmed that its semiconductor chip testing probes are primarily used for mid-to-high-end process chip testing [1] - The company is currently inquiring about whether it has received bulk equipment orders [1]

Core Viewpoint - The company, Yitang Co., confirmed its capability in producing equipment and technology related to HBM (High Bandwidth Memory) chips, highlighting its position as a leading enterprise in the integrated circuit equipment sector [1] Group 1: Company Capabilities - Yitang Co. possesses a range of equipment including plasma dry etching equipment, rapid thermal processing equipment, and dry etching and plasma surface treatment equipment, all of which have extensive experience in large-scale production [1] - The three categories of equipment offered by Yitang Co. are applicable for the production of HBM chips, indicating the company's readiness to support this advanced technology [1]