Investment Rating - The report assigns an "Accumulate" rating for the company, marking the first coverage of the stock [1]. Core Insights - The company, Yitang Co., Ltd. (屹唐股份), is positioned as a leading manufacturer of semiconductor front-end equipment, focusing on dry strip, rapid thermal processing (RTP), and etching equipment. It has established a platform-based layout to drive both domestic substitution and international expansion [12][16]. - The company has a strong market presence, holding the second-largest global market share in dry strip equipment at 34.6% and RTP equipment at 13.05% as of 2023 [21][30]. - The financial forecasts indicate steady revenue growth, with total revenue projected to reach 8,133 million yuan by 2027, reflecting a compound annual growth rate (CAGR) of 27.08% from 2023 to 2027 [1][34]. Summary by Sections Company Overview - Yitang Co., Ltd. was established in 2015 and specializes in high-end manufacturing of core equipment for integrated circuits. The company has developed a comprehensive international R&D and manufacturing system through acquisitions and partnerships, notably with Mattson Technology, Inc. [12][13]. Product and Market Position - The company has a well-established product matrix covering key processes in wafer manufacturing, including dry strip, RTP, and etching. Its products are widely used by leading semiconductor manufacturers such as SMIC, TSMC, Samsung, and Intel [12][16]. - The dry strip equipment has been developed over 30 years, featuring advanced technologies that ensure low particle contamination and cost efficiency. The RTP equipment is designed for advanced logic chips and DRAM, demonstrating compatibility with nodes at 10nm and below [18][19]. Financial Performance - The company has shown significant revenue growth, with total revenue increasing from 1.518 billion yuan in 2018 to 4.633 billion yuan in 2024, representing a CAGR of 20.4%. The net profit attributable to shareholders has also surged from 24 million yuan to 540.8 million yuan during the same period, with a CAGR of 68.5% [28][31]. - The report forecasts net profits of 652.35 million yuan in 2025, 851.69 million yuan in 2026, and 1,219.76 million yuan in 2027, indicating a strong upward trend in profitability [1][34]. R&D and Innovation - The company maintains a high R&D investment rate of around 15%, reflecting its commitment to innovation and technology development. As of mid-2025, the company had applied for 721 patents, with 474 granted, showcasing its focus on building a robust intellectual property portfolio [40][42]. Market Outlook - The global semiconductor equipment market is expected to recover, with projections indicating a market size of 125.5 billion USD in 2025 and 138.1 billion USD in 2026. The domestic market in China is anticipated to continue growing, driven by local wafer fabrication capacity expansion and increased penetration of domestic equipment [44][45].

Core Viewpoint - The company, Yitang Co., confirmed its capability in producing equipment and technology related to HBM (High Bandwidth Memory) chips, highlighting its position as a leading enterprise in the integrated circuit equipment sector [1] Group 1: Company Capabilities - Yitang Co. possesses a range of equipment including plasma dry etching equipment, rapid thermal processing equipment, and dry etching and plasma surface treatment equipment, all of which have extensive experience in large-scale production [1] - The three categories of equipment offered by Yitang Co. are applicable for the production of HBM chips, indicating the company's readiness to support this advanced technology [1]

Core Viewpoint - Yitang Co., Ltd. (688729.SH) is a leading enterprise in the integrated circuit equipment sector, specializing in equipment applicable for HBM chip production [1] Group 1: Company Overview - Yitang Co., Ltd. has extensive experience in mass production of plasma dry stripping equipment, rapid thermal processing equipment, and dry etching and plasma surface treatment equipment [1] - The company’s three main types of equipment are all applicable for the production of HBM chips [1]