Group 1: Company Operations and Capacity Utilization - The company's overall business operations are normal, with a comprehensive capacity utilization rate remaining relatively high. The PCB business benefits from sustained demand in computing power and automotive electronics, maintaining high capacity utilization [1] - The packaging substrate business has seen improved demand in the storage sector, with capacity utilization increasing compared to Q4 2024 and Q1 2025 [1] Group 2: Product Development and Project Progress - The company has achieved mass production capability for packaging substrates with up to 20 layers, and the technical development for products with over 20 layers is progressing as scheduled [1] - The Guangzhou packaging substrate project has entered its first phase, with production capacity steadily increasing and batch orders for BT and some FC-BGA products being accepted, although it is still in the early stages of capacity ramp-up [1][2] Group 3: Client Base and Market Position - The packaging substrate business serves a diverse client base, including IDM (Integrated Device Manufacturers), Fabless (semiconductor design companies), and OSAT (Outsourced Semiconductor Assembly and Test) manufacturers [3] Group 4: Expansion Plans and Technological Capabilities - The PCB business is expanding with factories located in Shenzhen, Wuxi, Nantong, and a new facility under construction in Thailand. The company is upgrading existing PCB factories to enhance capacity and is progressing with the Nantong Phase IV project to establish an HDI technology platform [4] - The company’s PCB business utilizes HDI technology, which allows for high-density wiring, primarily applied in communication, data centers, industrial control medical, and automotive electronics sectors [5] Group 5: Investment and Market Strategy - The total investment for the Thailand factory is 1.274 billion RMB, with construction progressing on schedule. The factory will have capabilities in high-layer and HDI PCB technologies, aiding in expanding overseas market reach [6] Group 6: Raw Material Price Trends - Key raw materials include copper-clad laminates, prepregs, copper foil, gold salts, and inks. In Q1 2025, prices for some raw materials, such as gold salts, increased year-on-year and compared to Q4 2024 due to commodity price fluctuations [7] Group 7: Compliance and Disclosure - The company adhered to the "Information Disclosure Management System" during the research process, ensuring no significant undisclosed information leaks occurred [8]

证券研究报告 | 公司点评 | 专用设备 PCB 设备收入拐点渐近，在手订单持续高增 ——东威科技年报和一季报点评 投资要点 ❑ 事件：2024 年，公司实现营业收入 7.50 亿元，同比下滑 17.51%，归母净利润 6927.29 万元，同比下滑 54.25%，扣非归母净利润 6145.94 万元，同比下滑 54.59%。 2025 年一季度，公司实现营业收入 2.11 亿元，同比增长 7.08%，归母净利润 1700.58 万元，同比下滑 45.11%，扣非归母净利润 1635.21 万元，同比下滑 43.21%。 ❑ 拐点已现，盈利能力受上游原材料涨价拖累 回顾 2024 年，锂电复合铜箔在动力电池领域的验证及订单进度不甚理想，受此 拖累，公司收入和利润上半年尚可，下半年下滑较多。另一方面，在 AI 服务器 和 AIDC 建设需求推动下，PCB 一线企业基本实现满产，扩产意愿逐渐复苏，凭 借在国内垂直连续电镀设备市场的领先地位，公司 PCB领域设备订单金额创历史 新高，收入拐点逐渐临近。利润方面，产能扩增的完成，整体折旧、摊销等增 加，导致成本费用有所上升，铜、不锈钢等原材料价格上涨，一定程度压缩了公 ...