Summary of Key Points from the Conference Call Industry Overview - The conference focused on the semiconductor industry, particularly advancements in AI chips, heterogeneous integration, advanced packaging, and optical interconnect technologies, reflecting the growing importance of these areas in the market [2][3][20]. Core Findings 1. **TSMC's Capacity Expansion**: TSMC is expected to expand its CoWoS capacity to 100kwpm by the end of 2026, up from 70kwpm at the end of 2025, driven by robust demand for Cloud AI GPUs and ASICs [3]. 2. **AI Computing Demand**: AI computing requirements have surged by 10x in the past year, necessitating advancements in chip scaling, memory, and interconnect technologies [3]. 3. **3.5D Advanced Packaging**: The event highlighted significant discussions around 3.5D advanced packaging, which is anticipated to become mainstream for high-performance computing, improving cost structures and product design speeds [3]. 4. **Heterogeneous Integration**: The trend towards co-packaged optics (CPO) is gaining traction, with expectations for power consumption to be optimized by 2028, allowing for the replacement of copper in AI server integrations [3]. 5. **Testing Innovations**: The complexity of die and package designs is increasing the need for more rigorous testing at the wafer/die level to identify yield issues early [3]. Stock Recommendations - Top stock picks in the Greater China semiconductor sector include TSMC, ASE, MediaTek, Alchip, and Aspeed, all rated as "Buy" due to their structural AI opportunities [4]. Additional Insights - **Optical Interconnects**: Nvidia's advancements in networking infrastructure, particularly with its Spectrum-X CPO solution, promise significant power savings and improved signal integrity [12]. - **AI Data Center Power Consumption**: The power consumption of AI data centers is projected to rise dramatically, with examples like Meta's Hyperion data center expected to consume 2GW by 2030 [16]. - **Challenges in Advanced Packaging**: The industry faces challenges in transitioning to panel-level packaging and CoWoP technologies, which require overcoming technical hurdles related to system design and materials [30][39]. Emerging Technologies - **Silicon Photonics**: TSMC's COUPE platform aims to enhance integration of optics and electrical signaling, addressing bandwidth bottlenecks in computing performance [12]. - **GaN Technology**: GaN is highlighted for its efficiency and potential in powering AI applications, with Texas Instruments and Infineon leading developments in this area [36][38]. Conclusion - The semiconductor industry is at a pivotal point, driven by AI advancements and the need for innovative packaging and integration solutions. Companies like TSMC, Nvidia, and MediaTek are positioned to capitalize on these trends, while challenges in testing and power consumption remain critical areas for development [3][4][16][20].

Financial Data and Key Metrics Changes - Cadence reported total revenue of $1.275 billion for Q2 2025, representing a 20% year-over-year growth, with non-GAAP EPS increasing by 29% to $1.65 [18][19] - The company raised its 2025 revenue growth outlook to 13% and EPS growth to 16% [6][17] - GAAP operating margin was reported at 19%, while non-GAAP operating margin was 42.8% [19] Business Line Data and Key Metrics Changes - Core EDA revenue grew by 16% year-over-year in Q2, with significant adoption of Cadence Cerebras solutions [12] - The IP business saw over 25% year-over-year growth in Q2, driven by demand in AI and HPC use cases [11] - System design and analysis business delivered 35% year-over-year revenue growth, with strong uptake of 3D IC technology [15] Market Data and Key Metrics Changes - China accounted for 9% of total revenue in Q2, down from 11% in Q1, but strength in other regions offset this decline [36] - The company noted robust design activity and customer demand globally, particularly in AI, HPC, and system design workloads [36][40] Company Strategy and Development Direction - Cadence continues to execute its intelligent system design strategy initiated in 2018, focusing on unified EDA, IP, and system analysis [7] - The company is leveraging its AI-driven product portfolio to capitalize on the AI super cycle, enhancing its competitive position [6][17] - Cadence is committed to compliance and has enhanced its processes in response to evolving trade restrictions [16][17] Management's Comments on Operating Environment and Future Outlook - Management expressed optimism about the demand for AI technologies and the overall customer environment, indicating a positive outlook for the next few years [30] - The company is focused on innovation and productivity, with expectations for continued growth in the second half of the year [21][40] Other Important Information - Cadence reached a settlement with the US Department of Justice and the Bureau of Industry and Security regarding investigations into transactions with customers in China, totaling approximately $45 million [19][16] - The One Big Beautiful Bill Act is expected to decrease Cadence's US federal tax payments by approximately $140 million for the remainder of fiscal 2025 [20] Q&A Session Summary Question: Impact of physical AI on bookings - Management noted that the optimism surrounding AI is driving increased customer investment in innovation, which is positively impacting bookings [24][25] Question: Increase in growth outlook despite China revenue restrictions - Management confirmed that strong demand across all geographies and a robust backlog contributed to the increased growth outlook, despite a decline in China revenue [34][36] Question: Near and long-term impact of China - Management expressed a cautious but optimistic view on China, indicating that while growth is expected to be slightly up, the rest of the world is performing even better [46][49] Question: Contribution of advanced packaging to revenue - Management highlighted that the industry is moving towards chiplet-based architectures, which is driving demand for Cadence's advanced packaging solutions [52][56] Question: Recurring revenue percentage and customer behavior - Management indicated that the recurring revenue percentage dipped to 78% due to paused revenue in China, but typically expects it to trend towards 80% [103][106] Question: Long-term perspective on IP growth - Management expressed optimism about IP growth, citing increased investment and opportunities from emerging chiplet architectures and advanced node foundries [110][112]

Summary of ASE's Role in the Next Heterogeneous Revolution Industry Overview - The document discusses the semiconductor packaging industry, specifically focusing on ASE's advancements in heterogeneous integration and photonic packaging technologies, particularly Silicon Photonics (SiPh) and Co-Packaged Optics (CPO) [4][12][18]. Core Points and Arguments 1. **Technological Evolution**: ASE is at the forefront of a significant technological evolution, transitioning from traditional electrical interconnects to photonic solutions, which are essential for meeting the demands of AI computing and high-performance computing (HPC) [4][5][12]. 2. **Heterogeneous Integration Strategy**: ASE's comprehensive strategy includes chiplet-based architectures, advanced fan-out, and 2.5D/3D integration, redefining semiconductor packaging boundaries [11][20]. 3. **Photonic Integration**: ASE emphasizes the critical role of photonic integration in enhancing bandwidth and reducing latency, addressing the limitations of traditional electrical interconnects [12][20][22]. 4. **VIPack™ Platform**: ASE's VIPack™ platform is designed to support advanced packaging technologies, enabling high-density integration and optimized design workflows, which can reduce time-to-market by up to 50% [27][33]. 5. **Market Growth Forecast**: ASE anticipates revenue from advanced packaging and testing to grow from USD $600 million in 2024 to over USD $1.6 billion in 2025, with over 75% of this growth attributed to cutting-edge packaging technologies [29]. Additional Important Content 1. **CPO Development**: ASE is positioning VIPack™ as a foundation for optical-electrical convergence, integrating SiPh and optical engines within a single package, which supports high-bandwidth, low-power applications [28][60]. 2. **System-Level Integration**: The integration of optical interconnects into packaging is seen as a fundamental architectural transformation, enabling better performance for AI accelerators and high-bandwidth memory modules [42][45]. 3. **Challenges in Transition**: The shift to CPO introduces challenges in packaging, interconnect, and testing, necessitating robust supply chain collaboration and new testing protocols [72][93]. 4. **New Value Creation**: The emergence of SiPh and CPO is redefining how chips, packages, and systems interact, creating a new value chain that emphasizes tighter integration across the semiconductor ecosystem [95][100]. Conclusion - ASE is not only responding to the rise of AI but is actively shaping the future of semiconductor packaging through innovative technologies and strategic investments in photonic integration and heterogeneous systems, positioning itself as a key enabler in the evolving landscape of AI and HPC [22][33][101].