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碳化硅进入先进封装主舞台:观察台积电的碳化硅战略 --- SiC Enters the Advanced Packaging Mainstage_ Observing TSMC’s SiC Strategy
2025-10-09 02:00
Observing TSMC's SiC Strategy :SiC Enters the Advanced Packaging Mainstage 观察台积电的碳化硅战略:碳化硅进入先进封装的 主舞台 Original Articles By SemiVision Research (Nvidia ,TSMC, Globalwafers, Wolfspeed) SemiVision Research 原创文章(英伟达、台积电、环球晶圆、Wolfspeed) SEP 21, 2025 2025 年 9 月 21 日 ∙ PAID ∙ 付费 SEMIVISION 7 Share 分享 20 shorten the power path and reduce PDN impedance, enabling faster voltage response. ASE, through its VIPack and FOCoS-Bridge (with TSV) platforms, is optimizing PDN, signal interconnects, and thermal performance sim ...
后摩尔时代,先进封装迈向“C位”
半导体行业观察· 2025-10-04 02:14
公众号记得加星标⭐️,第一时间看推送不会错过。 近年来,随着芯片制程工艺不断向前演进,"摩尔定律"的迭代进度逐渐放缓。曾经依靠制程迭 代实现晶体管密度翻倍、性能提升的传统路径,如今受限于物理极限与成本激增的双重挑战, 单纯依赖制程突破的发展模式渐显乏力。 在此背景下,半导体行业开始积极探索"后摩尔时代"的破局方向,先进封装技术凭借独特价值迅速成 为业界焦点。尤其是随着AI芯片对超高算力、低延迟的迫切需求,以及Chiplet异构集成技术的兴 起,先进封装不再只是芯片的"保护壳",更成为实现系统级性能跃升的关键载体。 与传统的封装技术相比,先进封装技术具有灵活性强、集成密度高、尺寸小、性能好等优势,主要包 括倒装芯片封装、晶圆级封装、系统级封装和2.5D、3D封装等技术。 据Yole Group预测,2030年全球先进封装市场规模将突破794亿美元,2024-2030年复合年增长率 (CAGR)达9.5%,AI与高性能计算需求成为拉动复苏的首要动能。市场潜力之下,行业厂商争相 布局,推动先进封装赛道成为驱动产业变革的新引擎。 代工三巨头,鏖战先进封装 在先进封装这一关键赛道,台积电、英特尔、三星等厂商作为先进封装 ...
2025 年台湾国际半导体展_3.5D 先进封装、共封装光学及更多测试_ SEMICON Taiwan 2025_ 3.5D advanced packaging, co-packaged optics and more testing
2025-09-15 13:17
Summary of Key Points from the Conference Call Industry Overview - The conference focused on the semiconductor industry, particularly advancements in AI chips, heterogeneous integration, advanced packaging, and optical interconnect technologies, reflecting the growing importance of these areas in the market [2][3][20]. Core Findings 1. **TSMC's Capacity Expansion**: TSMC is expected to expand its CoWoS capacity to 100kwpm by the end of 2026, up from 70kwpm at the end of 2025, driven by robust demand for Cloud AI GPUs and ASICs [3]. 2. **AI Computing Demand**: AI computing requirements have surged by 10x in the past year, necessitating advancements in chip scaling, memory, and interconnect technologies [3]. 3. **3.5D Advanced Packaging**: The event highlighted significant discussions around 3.5D advanced packaging, which is anticipated to become mainstream for high-performance computing, improving cost structures and product design speeds [3]. 4. **Heterogeneous Integration**: The trend towards co-packaged optics (CPO) is gaining traction, with expectations for power consumption to be optimized by 2028, allowing for the replacement of copper in AI server integrations [3]. 5. **Testing Innovations**: The complexity of die and package designs is increasing the need for more rigorous testing at the wafer/die level to identify yield issues early [3]. Stock Recommendations - Top stock picks in the Greater China semiconductor sector include TSMC, ASE, MediaTek, Alchip, and Aspeed, all rated as "Buy" due to their structural AI opportunities [4]. Additional Insights - **Optical Interconnects**: Nvidia's advancements in networking infrastructure, particularly with its Spectrum-X CPO solution, promise significant power savings and improved signal integrity [12]. - **AI Data Center Power Consumption**: The power consumption of AI data centers is projected to rise dramatically, with examples like Meta's Hyperion data center expected to consume 2GW by 2030 [16]. - **Challenges in Advanced Packaging**: The industry faces challenges in transitioning to panel-level packaging and CoWoP technologies, which require overcoming technical hurdles related to system design and materials [30][39]. Emerging Technologies - **Silicon Photonics**: TSMC's COUPE platform aims to enhance integration of optics and electrical signaling, addressing bandwidth bottlenecks in computing performance [12]. - **GaN Technology**: GaN is highlighted for its efficiency and potential in powering AI applications, with Texas Instruments and Infineon leading developments in this area [36][38]. Conclusion - The semiconductor industry is at a pivotal point, driven by AI advancements and the need for innovative packaging and integration solutions. Companies like TSMC, Nvidia, and MediaTek are positioned to capitalize on these trends, while challenges in testing and power consumption remain critical areas for development [3][4][16][20].
SEMICON TAIWAN现场调研反馈
2025-09-15 01:49
Summary of Key Points from the Conference Call Industry Overview - The conference focused on the AI computing industry, highlighting the significant role of system vendors like NVIDIA and Google in shaping market trends, while TSMC and ASML are pivotal in providing technological platforms [1][2] - Silicon photonics technology emerged as a key topic, aimed at reducing energy consumption unrelated to computation, with large-scale commercialization expected by 2027 [1][2] Company Insights TSMC - TSMC is advancing steadily in its technology, with 2nm process expected to achieve mass production by 2025 and ongoing development of 3nm technology, enhancing its pricing power and customer profitability [1][3] - Under the Foundry 2.0 concept, TSMC's advanced packaging revenue is accelerating, with six operational factories and plans for four new ones, including expansions of CoWoS, SoIC, and CoPoS platforms [1][15] - TSMC's average selling price (ASP) has nearly doubled from $3,000 in 2019 to over $7,000 currently, driven by its technological advantages [13] - Future revenue growth for TSMC is heavily reliant on high-performance computing (HPC) clients, with a 70%-80% growth rate among these customers [16] - TSMC's capital expenditures have increased, with a peak in 2021 at 50% of revenue, but the pressure is expected to ease moving forward [21] Oracle - Oracle's capital expenditures have significantly increased, potentially linked to securing a large order from OpenAI, which could drive additional computing demand [3][19] - If Oracle executes on its projected orders, it could benefit not only itself but also related companies like SoftBank and Industrial Fulian [19] Industrial Fulian - Industrial Fulian is positioned to benefit from the AI-related capital expenditure cycle, particularly in its cloud service equipment segment, which is expected to see rapid growth in 2025 and 2026 [23][24] Market Dynamics - The energy consumption associated with AI development is rising sharply, with cabinet energy consumption projected to increase from 60 kW in 2022 to 120 kW in 2025, and potentially reaching 500 kW by 2027 [10] - New AI chip architectures are emerging, such as 3D stacking and RISC-V based designs, which could significantly impact the market landscape [11] Competitive Landscape - Google and NVIDIA have different approaches in the semiconductor solutions space, with Google utilizing over 9,000 TPUs, while NVIDIA focuses on GPUs [7] - TSMC and ASML are leading the global semiconductor technology landscape, with TSMC introducing GAA technology and ASML advancing EUV lithography [8] Investment Outlook - TSMC is expected to see annual profit growth of 25%-30% in the coming years, with an attractive valuation compared to its peers [4][22] - The semiconductor industry is anticipated to continue evolving, with significant opportunities for companies like TSMC and Industrial Fulian in the AI computing supply chain [25]
台积电被迫提前生产计划!
国芯网· 2025-09-12 14:28
Core Viewpoint - The rapid development of AI chips by companies like NVIDIA has led to a surge in demand for advanced packaging services from TSMC, forcing the company to accelerate its production plans significantly [2][4]. Group 1: Market Demand and Production Challenges - TSMC is a leading supplier in advanced packaging technologies such as CoWoS, but it is currently unable to meet the overwhelming market demand on its own [4]. - The company has been compelled to speed up its production processes by more than 75%, and in some cases, by up to a year, deviating from traditional sequential deployment methods [4]. - The product cycles for AI GPU manufacturers like NVIDIA typically range from 6 months to a year, resulting in a sustained high demand for advanced packaging technologies like CoWoS and SoIC [4]. Group 2: Strategic Responses - To address these challenges, TSMC is implementing several forward-looking strategies, including pre-ordering necessary equipment and collaborating with local packaging suppliers [4]. - TSMC has formed a "3DIC Advanced Packaging Manufacturing Alliance," which includes members such as TSMC, ASE, and several other companies, to enhance its production capabilities [4]. - The introduction of NVIDIA's Rubin product line, which will debut six months after the Blackwell Ultra, highlights the need for timely delivery and adaptation to significant architectural differences between product lines [4].
SEMICON Taiwan 2025下周开幕 聚焦AI与先进封装
Xin Hua Wang· 2025-09-07 05:15
Group 1 - SEMICON Taiwan 2025 will focus on AI, CoWoS advanced packaging, and testing mass production progress from September 10-12 [1] - The semiconductor industry is facing bottlenecks in process miniaturization, with heterogeneous integration and advanced packaging emerging as breakthrough directions [1] - Demand for AI, high-performance computing (HPC), and HBM is increasing, making advanced packaging technologies like 3D IC and panel-level fan-out packaging core to semiconductor innovation [1] Group 2 - TSMC's CoWoS, InFO, and SoIC advanced packaging technologies are applicable for AI and HPC chips, with CoWoS already in mass production [1] - NVIDIA and AMD have strong ongoing demand for CoWoS, while Apple requires TSMC's InFO technology for high-end processors [1] - TSMC is expanding its CoWoS and InFO advanced packaging lines in the U.S. due to strong demand and U.S. government support for domestic semiconductor manufacturing [1] Group 3 - TSMC announced a $100 billion investment in advanced semiconductor manufacturing in the U.S., totaling $165 billion, which includes two advanced packaging facilities [2] - TSMC aims to balance the supply-demand gap for CoWoS advanced packaging, with expected monthly capacity exceeding 90,000 to 95,000 pieces by the end of 2026 [2] - Non-TSMC CoWoS capacity is projected to reach 12,000 pieces monthly by the end of next year, with nearly 60% of overall annual capacity still supplied to NVIDIA [2]
三星封装,在美“掉队”?
半导体芯闻· 2025-08-29 10:12
Group 1 - TSMC is actively investing in advanced packaging capacity in the U.S. as part of its strategy to strengthen the domestic semiconductor supply chain, with a total investment of $100 billion planned for new facilities [2][3] - TSMC's two advanced packaging plants, AP1 and AP2, will be located in Arizona and are expected to start construction in the second half of next year, with production anticipated to begin in 2028 [2][3] - AP1 will focus on SoIC (system-on-integrated-chips) technology, which utilizes 3D stacking to enhance data transfer speed and energy efficiency, while AP2 will specialize in CoPoS (Chip-on-Panel-on-Substrate) technology, improving production efficiency and supporting larger chip sizes [3] Group 2 - The acceleration of TSMC's advanced packaging deployment is closely related to supply chain security considerations, as the U.S. government encourages semiconductor production to return domestically through subsidies and tariffs [3][4] - Samsung Electronics is investing $37 billion in a 2nm advanced wafer fab in Texas, aiming to produce AI chips for Tesla, but is cautious about investing in advanced packaging due to unclear customer demand [4][5] - Samsung's current focus on producing Tesla's 2nm chips presents significant challenges, and the company may face excessive pressure if it simultaneously invests heavily in advanced packaging [5]
台积电美国封装厂,重要进展
半导体行业观察· 2025-08-27 01:33
Core Viewpoint - TSMC is accelerating its expansion in the United States, planning to establish two advanced packaging plants (AP1, AP2) with construction expected to start in the second half of 2026 and operational by 2028, in response to local demand for AI and HPC chip packaging [2][3]. Group 1: Expansion Plans - TSMC's second wafer fab (P2) in the U.S. is set to introduce 2nm process technology earlier than initially planned, while the advanced packaging plants are located directly across from P3, with construction now expedited to 2026 [2][3]. - The company aims to build two new advanced packaging facilities and a research center in Arizona, enhancing the AI supply chain [2][3]. Group 2: Technology and Production - AP1 will incorporate SoIC and CoW technologies, while AP2 is focused on CoPoS, which is expected to mature by 2028 [3][4]. - SoIC is currently TSMC's most advanced packaging technology, already in mass production for clients like AMD, Apple, and NVIDIA [3][4]. Group 3: Investment and Market Impact - TSMC announced a $100 billion investment in the U.S., which includes the construction of three wafer fabs, two advanced packaging facilities, and a research center, marking the largest single foreign direct investment in U.S. history [6][7]. - The establishment of advanced packaging lines in the U.S. is driven by the needs of major clients such as Apple, NVIDIA, and AMD, with a focus on CoWoS and InFO technologies [6][8]. Group 4: Supply Chain Considerations - The construction of advanced packaging facilities requires a complete supply chain, including materials and testing capabilities, which may take at least four years to establish [7][8]. - TSMC's expansion in the U.S. could impact the existing packaging and testing supply chain in Taiwan, necessitating a mature ecosystem for testing and packaging [8][9].
台积电最热门技术,崩盘了?
半导体行业观察· 2025-08-08 01:47
Core Viewpoint - TSMC's CoWoS advanced packaging technology is experiencing a supply-demand imbalance, with a capacity utilization rate of only 60%, leading to supply chain disruptions [2][3] Group 1: Capacity Expansion Plans - TSMC plans to increase its CoWoS capacity by 33% by 2026, driven by strong demand for AI computing power [4][6] - The expansion will benefit the AI ASIC supply chain and companies like NVIDIA that rely heavily on advanced semiconductor technology [5][6] - The new facilities, including the AP8 wafer fab, will support various production lines, with a focus on AI applications [2][4] Group 2: Market Dynamics and Demand - Despite strong AI demand, there are indications that procurement of CoWoS equipment may slow down after existing orders are fulfilled [3][4] - The rapid expansion of TSMC's capacity may have outpaced actual demand, leading to potential adjustments in wafer production from clients like NVIDIA and AMD [2][3] - The semiconductor industry is witnessing increased investments to meet the growing demand for AI and high-performance computing solutions [6]
台积电,靠封装赢麻了
半导体芯闻· 2025-07-30 10:54
Core Insights - The article discusses the projected demand for CoWoS wafers, predicting that global demand will reach 1 million pieces by 2026, with TSMC dominating the capacity allocation and Nvidia securing 60% of the CoWoS capacity [1][2]. Group 1: TSMC and CoWoS Technology - TSMC is expected to produce approximately 510,000 CoWoS wafers for Nvidia's next-generation Rubin architecture AI chips, which will account for about 60% of the global market demand [1]. - The CoWoS technology is crucial for enhancing signal transmission efficiency and chip density while reducing power consumption and heat dissipation, making it the standard packaging method for high-end AI chips [3]. Group 2: US Manufacturing Expansion - TSMC plans to build an advanced packaging facility in Arizona, which will include CoWoS, SoIC, and CoW technologies, with 60% of the capacity dedicated to Nvidia [2]. - The establishment of the US facility aims to strengthen the local supply chain, mitigate geopolitical risks, and address the increasing demand for advanced packaging technologies driven by AI and high-performance computing chips [2]. Group 3: Investment and Future Projections - Since Trump's second term, TSMC has announced a total investment plan of up to $100 billion, covering wafer fabs, R&D centers, and advanced packaging facilities [2]. - The anticipated output from Nvidia's chips could reach 5.4 million units by 2026, with 2.4 million units coming from the Rubin platform [1].