For more information, visit Legrand at the OCP Global Summit or online at the company's website. Accessibility StatementSkip Navigation Legrand team members to highlight ongoing product innovations at OCP Global Summit, October 13-16, 2025, in San Jose, California WEST HARTFORD, Conn., Sept. 30, 2025 /PRNewswire/ -- Legrand, a global specialist in electrical and digital building infrastructure, is heading to this year's Open Compute Project (OCP) Global Summit with a key mission – to highlight its new selec ...

Summary of the Conference Call Notes Industry Overview - The focus of the 2025 Open Compute Project (OCP) will be on the US Communications Equipment industry, particularly in areas such as intra networking, photonics, and AI clusters [1] Key Points 1. **Conference Details**: The OCP will take place in San Jose from October 13th to 16th, 2025, emphasizing the need for open scale-up and scale-out architecture, particularly with Ethernet and UALink technologies [1] 2. **Optical Innovations**: There will be discussions on optical innovations that support the growth of AI clusters and how optical technologies can help manage the increasing power consumption in AI data centers [1] 3. **Sustainability Focus**: The conference will address the development of sustainable and power-efficient zettascale AI clusters, indicating a trend towards environmentally conscious technology solutions [1] 4. **Investment Opportunities**: The event is expected to act as a catalyst for companies involved in intra and inter-server networking, suggesting potential investment opportunities in this sector [1] 5. **Citi's Participation**: Citi will host an investor booth tour featuring companies like Astera Labs, Credo, and Advanced Energy, along with a client dinner with Dell'Oro's data center and switching experts [1] Additional Important Information - The conference is anticipated to provide insights into the challenges and advancements in the communications equipment sector, particularly in relation to AI and networking technologies [1] - Investors are encouraged to engage with the companies and presenters during the event to gain deeper insights into the market dynamics and potential investment strategies [1]

Summary of Key Takeaways from APAC's OCP Summit Industry Overview - The report focuses on the AI server development industry, particularly the challenges and innovations discussed at the APAC's Open Compute Project (OCP) Summit held in Taipei on August 5-6, 2025. Core Points and Arguments 1. **AI Datacenter Clusters and Power Innovations**: Current large-scale datacenters consume between 50-100MW and are not fully compliant with AI server hosting standards. Companies like Meta are planning to build Titan AI clusters, with the first 1GW+ AI datacenter (Prometheus) expected to be operational by 2026. Another datacenter, Hyperion, will have a capacity of up to 5GW. Key beneficiaries include Delta, Vertiv, and power plant vendors [1][12][31]. 2. **Capex Increase for US CSPs**: The top four US Cloud Service Providers (CSPs) are expected to increase their capital expenditures (Capex) by 55% and 25% year-over-year in 2025 and 2026, respectively, indicating a robust multi-year investment in AI infrastructure [1][12]. 3. **Modular Design Trends**: The DC-MHS (Datacenter Modular Hardware System) is gaining traction as a modularized computing platform that enhances scalability and cost efficiency. Intel is a key player in this trend, which is expected to see high adoption rates starting with its next-generation server platform [9][12]. 4. **Customized Liquid Cooling Solutions**: There is a rising demand for customized liquid cooling solutions among the top four US CSPs. Amazon is shifting to its proprietary thermal solution, IRHX, while Google is developing a customized L2L CDU design. Delta is identified as a key ODM for these solutions [12][31]. 5. **HVDC Power Technologies**: The report discusses bifurcated HVDC (High Voltage Direct Current) power technologies, with a focus on the ±400V architecture being more favorable due to its compatibility with existing datacenter practices. This shift could benefit suppliers of SiC or GaN components [18][21]. 6. **Increased Content in Power Rack Designs**: CSPs are expected to introduce side power rack designs to accommodate higher power density. This will lead to significant content increases for system vendors like Delta, as the complexity of power delivery systems rises [21][23]. 7. **Vertical Power Delivery Adoption**: Vertical power delivery is anticipated to become more common in next-generation AI accelerators, driven by the need for power efficiency. This trend is expected to benefit power vendors like Delta and Infineon [29][31]. 8. **Networking Equipment Upgrades**: The demand for high-end networking equipment is increasing due to the growth of AI clusters. Ethernet technologies are being explored as alternatives to Infiniband for scale-up networking solutions, which could benefit Ethernet switch vendors [31][32]. Other Important Insights - The introduction of OpenBMC and Caliptra is expected to enhance security in server designs without necessarily lowering entry barriers for BMC chip vendors [7][12]. - The report highlights the importance of customized solutions in the evolving landscape of AI server infrastructure, indicating a shift towards more tailored approaches in hardware design and cooling solutions [12][31]. This summary encapsulates the key insights and trends discussed at the OCP Summit, emphasizing the ongoing innovations and investment opportunities within the AI server development industry.

Summary of Key Points from the OCP APAC Summit Industry Overview - The Open Compute Project (OCP) is an industry consortium focused on redesigning hardware technology for data centers, emphasizing efficiency, scalability, and openness. It has over 400 members as of 2025, initiated by Meta in 2011 [3][2]. Core Insights and Arguments AI Data Center Innovations - The OCP APAC Summit highlighted advancements in AI hardware, infrastructure, and networking, with participation from major tech companies like Google, Meta, Microsoft, TSMC, and AMD [2][7]. - Meta is aggressively launching its Hyperion data center, which is expected to significantly benefit server ODMs like Quanta and Wiwynn [4][29]. - AMD's UALink and Ultra Ethernet are set to enhance networking capabilities, enabling larger clusters and improved performance [9][11]. Power and Cooling Solutions - The power consumption of AI servers is projected to double, with NVIDIA's GPUs expected to reach 3,600W by 2027, necessitating a shift to high-voltage direct current (HVDC) systems for efficiency [23][24]. - Liquid cooling is becoming essential for managing the thermal load of high-density AI racks, with designs evolving to accommodate this need [34][23]. Market Dynamics - The AI hardware market is transitioning from proprietary solutions to a more open, collaborative environment, benefiting specialized hardware vendors [10][11]. - The back-end networking market for AI is projected to exceed $30 billion by 2028, driven by the demand for high-bandwidth communication within AI clusters [18]. Important but Overlooked Content - The shift to panel-level processing by ASE is a critical innovation for manufacturing larger AI packages, improving area utilization and cost-effectiveness [13]. - The integration of retimers in cables is essential for maintaining signal integrity in high-density AI racks, addressing challenges posed by traditional passive copper cables [18]. - MediaTek is positioning itself as a leader in on-device AI integration, which is crucial as the demand for edge computing grows [26][30]. Company-Specific Highlights - **Delta**: Target price raised from $460 to $715 due to strong growth momentum driven by AI power needs [21]. - **Google**: Engaging with OCP to upgrade AI infrastructure, including the introduction of the Mt. Diablo power rack for efficient power distribution [24][33]. - **Seagate**: Emphasized the complementary role of HDDs alongside SSDs for high-capacity storage in AI applications [39][41]. - **TSMC**: Focused on co-development of system-level standards to support higher performance compute systems [40]. Conclusion The OCP APAC Summit underscored the rapid evolution of AI infrastructure, highlighting the importance of collaboration among tech giants to address the challenges of power, cooling, and networking in data centers. The insights gained from this event will shape the future landscape of AI technology and its supporting ecosystem.