Core Viewpoint - The article discusses the launch of the EDA2025 software suite by Xpeedic Technology, emphasizing the need for a new infrastructure to support AI development in the semiconductor industry, which requires a systematic approach that integrates various technologies beyond single-chip designs [1][10]. Group 1: EDA2025 Software Suite Overview - Xpeedic's EDA2025 software suite is positioned for "STCO integrated system design," providing a comprehensive EDA platform that covers multiple physical engine technologies such as SI/PI, electromagnetic, thermal, and stress analysis [3][11]. - The suite aims to empower the design of next-generation high-speed, high-frequency smart electronic products, supporting advanced packaging technologies like Chiplet [3][11]. Group 2: Key Features of EDA2025 - The Metis platform is designed for 2.5D and 3D ICs, enabling large-scale signal and power network electromagnetic field simulations and model extraction, with enhancements in power frequency domain simulation [7][8]. - Notus serves as a platform for collaborative analysis of packaging and board-level SI/PI, allowing for quick assessments of signal, power, temperature, and stress distributions [6][7]. - ChannelExpert is a general verification platform for signal integrity, providing methods for evaluating and resolving high-speed channel issues, with enhancements in DDR simulation capabilities [8][9]. Group 3: Industry Context and Future Directions - The article highlights the transition to an AI-driven era, where Xpeedic's EDA solutions will leverage STCO integration advantages to optimize the performance of high-speed, high-frequency smart electronic products, addressing key requirements such as high computing power, low power consumption, and high bandwidth [10][11].