Investment Rating - The report maintains a positive outlook on the EDA industry, particularly focusing on the multi-physics simulation segment, which is expected to see significant growth due to the increasing complexity of semiconductor designs and the integration of EDA and CAE tools [1][2]. Core Insights - The EDA industry is entering a system-level era, with multi-physics simulation becoming a critical requirement as the semiconductor sector shifts towards advanced packaging and multi-die chip designs. This trend is driven by the need for enhanced performance and efficiency in AI chips, which are increasingly sensitive to physical disturbances [1][2][3]. - The report highlights that the market for EDA tools is projected to grow at a compound annual growth rate (CAGR) of 8.1% over the next five years, with the CAE sub-sector expected to grow at a much higher CAGR of 25.8% [1][2]. - Major acquisitions by leading EDA companies, such as Synopsys acquiring Ansys, Cadence's strategic mergers, and Siemens' acquisition of Altair, validate the trend towards system-level integration and the necessity for multi-physics simulation capabilities [1][2][3]. Summary by Sections 1. Multi-Physics Simulation: A Key Demand in the System-Level Era - Multi-physics simulation is essential for modeling complex systems where multiple physical fields interact, particularly in the semiconductor industry as designs become more intricate with advanced packaging technologies [8][12]. - The increasing complexity of chip designs necessitates early-stage simulations to predict potential issues, thereby reducing development costs and risks [8][12]. 2. Overseas Trends: Major Acquisitions Validate the "System-Level" Trend - Synopsys' acquisition of Ansys for $35 billion aims to enhance its multi-physics simulation capabilities, addressing the urgent need for system-level simulations in the semiconductor industry [54][55]. - Cadence is actively acquiring smaller firms to build a comprehensive multi-physics simulation portfolio, enhancing its capabilities across chip, packaging, and system levels [58][59]. 3. Domestic Trends: Chip and Semiconductor Positioning in System-Level EDA - The report emphasizes that domestic companies like Chip and Semiconductor are focusing on system-level EDA, filling gaps in the market for multi-physics simulation tools [1][2][3]. - The current landscape shows that domestic EDA companies primarily offer chip-level design tools, indicating a need for development in system-level multi-physics simulation capabilities [1][2].

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Core Viewpoint - The article discusses the launch of the EDA2025 software suite by Xpeedic Technology, emphasizing the need for a new infrastructure to support AI development in the semiconductor industry, which requires a systematic approach that integrates various technologies beyond single-chip designs [1][10]. Group 1: EDA2025 Software Suite Overview - Xpeedic's EDA2025 software suite is positioned for "STCO integrated system design," providing a comprehensive EDA platform that covers multiple physical engine technologies such as SI/PI, electromagnetic, thermal, and stress analysis [3][11]. - The suite aims to empower the design of next-generation high-speed, high-frequency smart electronic products, supporting advanced packaging technologies like Chiplet [3][11]. Group 2: Key Features of EDA2025 - The Metis platform is designed for 2.5D and 3D ICs, enabling large-scale signal and power network electromagnetic field simulations and model extraction, with enhancements in power frequency domain simulation [7][8]. - Notus serves as a platform for collaborative analysis of packaging and board-level SI/PI, allowing for quick assessments of signal, power, temperature, and stress distributions [6][7]. - ChannelExpert is a general verification platform for signal integrity, providing methods for evaluating and resolving high-speed channel issues, with enhancements in DDR simulation capabilities [8][9]. Group 3: Industry Context and Future Directions - The article highlights the transition to an AI-driven era, where Xpeedic's EDA solutions will leverage STCO integration advantages to optimize the performance of high-speed, high-frequency smart electronic products, addressing key requirements such as high computing power, low power consumption, and high bandwidth [10][11].