甬矽电子（宁波）股份有限公司2025 年半年度报告 公司代码：688362 公司简称：甬矽电子 转债代码：118057 转债简称：甬矽转债 甬矽电子（宁波）股份有限公司 甬矽电子（宁波）股份有限公司2025 年半年度报告 重要提示 一、 本公司董事会、监事会及董事、监事、高级管理人员保证半年度报告内容的真实性、准确 性、完整性，不存在虚假记载、误导性陈述或重大遗漏，并依法承担法律责任。 二、 重大风险提示 公司已在本报告中详细阐述公司在经营过程中可能面临的各种风险及应对措施，敬请查阅本 报告第三节"管理层讨论与分析"中"四、风险因素"相关内容。 三、 公司全体董事出席董事会会议。 四、 本半年度报告未经审计。 五、 公司负责人王顺波、主管会计工作负责人金良凯及会计机构负责人（会计主管人员）金良 凯声明：保证半年度报告中财务报告的真实、准确、完整。 六、 董事会决议通过的本报告期利润分配预案或公积金转增股本预案 不适用 七、 是否存在公司治理特殊安排等重要事项 □适用 √不适用 八、 前瞻性陈述的风险声明 √适用 □不适用 本报告所涉及的公司未来计划、发展战略等前瞻性陈述，不构成公司对投资者的实质承诺， 请投资 ...

Core Viewpoint - The company, Yongxi Electronics, reported significant growth in revenue and net profit for the year 2024, driven by increased market demand and the introduction of new product lines. The company has also decided not to distribute cash dividends for the year due to its strategic development plans and capital needs. Company Overview - Yongxi Electronics primarily engages in integrated circuit packaging and testing, providing solutions for integrated circuit design companies. Its packaging products include various advanced packaging types such as FC, SiP, Bumping, QFN/DFN, and MEMS [5][6][7]. - The company was established in November 2017 and has focused on advanced packaging in the semiconductor testing industry, achieving notable technological advantages in various advanced packaging forms [6][7]. Business Model - The company's main business model involves customized packaging solutions based on client requirements, where clients provide unprocessed wafers for packaging and testing [8]. - The production model emphasizes high-end packaging and testing products, utilizing advanced automated production equipment and a flexible production approach to enhance efficiency and yield [8][9]. - The sales model is primarily direct sales to chip design companies, with some products in the cryptocurrency sector sold through agency models to manage operational risks [10]. Industry Situation - The integrated circuit packaging and testing industry has evolved into a specialized sector within the semiconductor industry, with significant market share concentrated in the Asia-Pacific region [12][13]. - The global packaging market is projected to reach $89.9 billion in 2024, with advanced packaging accounting for 49% of this market. The demand for advanced packaging is driven by applications in AI, 5G, and IoT [14][15]. - The industry is experiencing a shift towards advanced packaging technologies, such as Chiplet, which are expected to enhance chip performance as traditional scaling approaches face limitations [20][21]. Financial Performance - For the year 2024, Yongxi Electronics achieved a revenue of 3.609 billion yuan, a year-on-year increase of 50.96%. The net profit attributable to shareholders was 66.33 million yuan, reflecting a significant increase compared to the previous year [23]. - The company reported a net cash flow from operating activities driven by revenue growth, indicating improved operational efficiency [23]. Future Development Trends - The company plans to continue focusing on advanced packaging technologies and expanding its product lines, including Bumping and 2.5D packaging, to enhance its competitive edge [55]. - The overall semiconductor industry is expected to grow, with a forecasted global market valuation of $697 billion by 2025, driven by advancements in logic and memory sectors [21][22].