甬矽电子（宁波）股份有限公司2025 年半年度报告 公司代码：688362 公司简称：甬矽电子 转债代码：118057 转债简称：甬矽转债 甬矽电子（宁波）股份有限公司 甬矽电子（宁波）股份有限公司2025 年半年度报告 重要提示 一、 本公司董事会、监事会及董事、监事、高级管理人员保证半年度报告内容的真实性、准确 性、完整性，不存在虚假记载、误导性陈述或重大遗漏，并依法承担法律责任。 二、 重大风险提示 公司已在本报告中详细阐述公司在经营过程中可能面临的各种风险及应对措施，敬请查阅本 报告第三节"管理层讨论与分析"中"四、风险因素"相关内容。 三、 公司全体董事出席董事会会议。 四、 本半年度报告未经审计。 五、 公司负责人王顺波、主管会计工作负责人金良凯及会计机构负责人（会计主管人员）金良 凯声明：保证半年度报告中财务报告的真实、准确、完整。 六、 董事会决议通过的本报告期利润分配预案或公积金转增股本预案 不适用 七、 是否存在公司治理特殊安排等重要事项 □适用 √不适用 八、 前瞻性陈述的风险声明 √适用 □不适用 本报告所涉及的公司未来计划、发展战略等前瞻性陈述，不构成公司对投资者的实质承诺， 请投资 ...

Core Viewpoint - Yongxi Electronics focuses on mid-to-high-end advanced packaging and testing business, enhancing its one-stop delivery capability of "Bumping+CP+FC+FT" and successfully breaking into major clients like MediaTek and Realtek, with fundraising aimed at increasing heterogeneous packaging capacity [1][5] Group 1: Financial Performance and Projections - The company plans to issue convertible bonds to raise up to 1.165 billion yuan, with 900 million yuan allocated for R&D and industrialization of advanced heterogeneous packaging technology [1] - The company expects to achieve revenue of 1.239 billion yuan and a net profit of 396 million yuan after the project reaches full production [1] - For the first half of 2025, the company anticipates revenue between 1.9 billion and 2.1 billion yuan, representing a year-on-year growth of 16.60% to 28.88% [3] - In Q2 2025, the expected revenue is between 955 million and 1.155 billion yuan, with a year-on-year growth of 0.96% to 22.11% [3] Group 2: Client Relationships and Market Position - The company has established a core customer base primarily consisting of well-known chip design companies, including partnerships with companies like Hengxuan Technology, Amlogic, and MediaTek [2] - Realtek and MediaTek are projected to be among the top five customers in 2024, with sales amounts of 231 million yuan and 225 million yuan, respectively [2] Group 3: Product Offerings and Technological Advancements - The company's packaging products include five major categories: FC products, SiP, WLP, QFN/DFN, and MEMS, with over 2,100 product varieties [2] - The company has achieved mass production of advanced system-level packaging products that can simultaneously package multiple chips and components, showcasing significant technological capabilities [4] - The company has reached industry-leading specifications in advanced wafer-level packaging, with minimum pitch and diameter of micro bumps at 45μm and 30μm, respectively [4]

1. Report Industry Investment Rating - No industry investment rating is provided in the report. 2. Core Viewpoints of the Report - The target price of Yongxi Convertible Bonds on the first - day of listing is expected to be between 128 - 133 yuan, and it is recommended to actively subscribe. The expected first - day conversion premium rate is in the range of 23% - 28%. The expected first - day new bond lottery winning rate is around 0.0074% - 0.0103% [3][20][21]. 3. Summary According to the Directory 3.1 Yongxi Convertible Bonds New Issue Analysis and Investment Recommendations 3.1.1 Convertible Bond Basic Terms Analysis - The issuance methods of Yongxi Convertible Bonds are priority placement and online issuance, with a bond and issuer rating of A+. The issuance scale is 1.165 billion yuan, the initial conversion price is 28.39 yuan, and the conversion parity on June 25, 2025, is 103.77 yuan. The calculated pure bond value is 83.7 yuan. The game terms are normal. Overall, the bond issuance scale is relatively high, the liquidity is acceptable, the rating is weak, and the bond floor protection is acceptable. It is difficult for institutions to include it in their portfolios, but there is no objection to primary participation [2][16]. 3.1.2 New Bond Initial Listing Price Analysis - The company's main business is integrated circuit packaging and testing. The main products and services include five major categories with over 2,100 mass - produced varieties. The funds raised from this issuance are mainly used for the "Multi - dimensional Heterogeneous Advanced Packaging Technology R & D and Industrialization Project", which can optimize the company's capital structure and enhance its competitiveness [3][19]. - The target price of Yongxi Convertible Bonds on the first - day of listing is 128 - 133 yuan, and it is recommended to actively subscribe. The expected first - day conversion premium rate is in the range of 23% - 28% [3][20]. 3.1.3 Convertible Bond New Issue Lottery Winning Rate Analysis - The expected first - day new bond lottery winning rate is around 0.0074% - 0.0103%. Assuming the old shareholders' placement ratio is 30% - 50%, the scale available for the market is 583 million - 816 million yuan. Referring to recent similar bond issues, the online effective subscription number is assumed to be 7.92 million households [21]. 3.2 Underlying Stock Fundamental Analysis 3.2.1 Company's Main Business and Industry Upstream and Downstream Situations - The company's main business is integrated circuit packaging and testing, with five major product categories and over 2,100 mass - produced varieties [22]. - The main upstream industries are packaging and testing raw materials and equipment industries, and the company has established good long - term cooperative relationships with many suppliers. The main downstream industry is the IC design industry, and the market scale and development speed of the downstream industry directly affect the company's sales revenue [22][23]. 3.2.2 Company's Operating Conditions - The company's recent operating income has shown an overall upward trend. From 2022 to Q1 2025, the operating income was 2.177 billion yuan, 2.391 billion yuan, 3.609 billion yuan, and 945 million yuan respectively, with year - on - year growth rates of 5.96%, 9.82%, 50.96%, and 30.12% respectively [26]. - The company's comprehensive gross profit margin has shown a fluctuating trend. From 2022 to Q1 2025, the comprehensive gross profit margin was 21.91%, 13.9%, 17.33%, and 14.19% respectively, and the net profit margins were 6.3%, - 5.65%, 1.09%, and 0.96% respectively [27]. - The company's recent period expenses have shown an upward trend, and the R & D expenses have gradually increased. The accounts receivable have shown a slight fluctuation, and the accounts receivable turnover rate has shown a slight downward trend but is at a medium level compared with the industry [31][33][36]. - The company's recent attributable net profit has shown a fluctuating trend. In 2023, the company suffered a loss, and in 2024, it turned losses into profits [40]. 3.2.3 Company's Equity Structure and Major Controlling Subsidiaries - The company's equity structure is relatively concentrated. As of June 10, 2025, the top two major shareholders hold 25.69% of the shares in total, and the top ten major shareholders hold 52.92% of the shares in total. The company's direct controlling shareholder is Yongshunxin Electronics, and the actual controller is Wang Shunbo, who holds 31.70% of the total shares. The company has 2 wholly - owned subsidiaries, 1 controlling subsidiary, and 2 affiliated companies [42][44]. 3.2.4 Company's Business Characteristics and Advantages - The company has advantages in technological innovation, talent reserve, customer cooperation, and quality assurance. It focuses on the advanced packaging field, has a large number of patents, a complete R & D system, and good cooperation with well - known design companies, and has established a quality control system [47][48][49]. 3.2.5 Allocation of Funds Raised in This Issuance - The company plans to issue convertible bonds to raise a total of no more than 1.165 billion yuan. 900 million yuan is planned to be invested in the "Multi - dimensional Heterogeneous Advanced Packaging Technology R & D and Industrialization Project", with a total investment of 1.464 billion yuan. After the project is completed, it will form an annual production capacity of 90,000 pieces of multi - dimensional heterogeneous advanced packaging products, and the project has good economic benefits [50].

"宁波膜智信息科技有限公司"为势银（TrendBank）唯一工商注册实体及收款账户 势银研究： 势银产业研究服务 势银数据： 势银数据产品服务 势银咨询： 势银咨询顾问服务 重要会议： 4月29日，2025势银异质异构集成封装产业大会（浙江宁波） 点此报名 添加文末微信，加 先进封装 群 2024 年，随着全球终端消费市场出现回暖，产业链去库存周期基本结束，叠加AI 应用场景不断涌现，集成电路行业整体景气度回升明显。根据 美国半导体行业协会（SIA）数据，2024年全球半导体销售额达到 6,276 亿美元，同比增长 19.1%，首次突破 6,000 亿美元大关。 近日，甬矽电子（宁波）股份有限 公司 发布了 2024年年度报告，报告显示，2024年甬矽电子 实现营业收入 360,917.94 万元，同比增长 50.96%；实现归属于母公司所有者的净利润 6,632.75 万元，较上年同期增长 15,971.54 万元，实现扭亏为盈。 | | | | | 甲V: 九 | | --- | --- | --- | --- | --- | | 主要会计数据 | 2024年 | 2023年 | 本期比上 年同期增 | ...