Core Viewpoint - Shenghe Jingwei has received approval for its IPO on the Sci-Tech Innovation Board, aiming to raise 4.8 billion yuan to invest in advanced packaging projects and enhance its production capacity in the semiconductor industry [1]. Group 1: Company Overview - Shenghe Jingwei is a leading advanced packaging and testing enterprise in the integrated circuit industry, focusing on 12-inch wafer processing and providing a full range of advanced packaging services [1][2]. - The company was established in 2014 as a joint venture between SMIC and JCET, addressing the gap in 12-inch wafer processing capabilities in China [1][3]. Group 2: Market Position and Achievements - Shenghe Jingwei is recognized as one of the earliest companies in mainland China to achieve mass production of 12-inch Bumping technology and is the first to offer 14nm advanced process Bumping services [2][3]. - As of 2024, the company holds the largest market share in mainland China for 12-inch WLCSP, with approximately 31% of the revenue in this segment [2]. - The company has also established itself as the leading provider of 2.5D integration technology in mainland China, with an 85% market share in revenue for this segment in 2024 [3]. Group 3: Financial Performance - In 2024, the multi-chip integration packaging segment became the largest revenue contributor for Shenghe Jingwei, accounting for 44.39% of total revenue, and is projected to increase to 56.24% in the first half of 2025 [4].