Core Viewpoint - Shenghe Jingwei has received approval for its IPO on the Sci-Tech Innovation Board, aiming to raise 4.8 billion yuan to invest in advanced packaging projects and enhance its production capacity in the semiconductor industry [1]. Group 1: Company Overview - Shenghe Jingwei is a leading advanced packaging and testing enterprise in the integrated circuit industry, focusing on 12-inch wafer processing and providing a full range of advanced packaging services [1][2]. - The company was established in 2014 as a joint venture between SMIC and JCET, addressing the gap in 12-inch wafer processing capabilities in China [1][3]. Group 2: Market Position and Achievements - Shenghe Jingwei is recognized as one of the earliest companies in mainland China to achieve mass production of 12-inch Bumping technology and is the first to offer 14nm advanced process Bumping services [2][3]. - As of 2024, the company holds the largest market share in mainland China for 12-inch WLCSP, with approximately 31% of the revenue in this segment [2]. - The company has also established itself as the leading provider of 2.5D integration technology in mainland China, with an 85% market share in revenue for this segment in 2024 [3]. Group 3: Financial Performance - In 2024, the multi-chip integration packaging segment became the largest revenue contributor for Shenghe Jingwei, accounting for 44.39% of total revenue, and is projected to increase to 56.24% in the first half of 2025 [4].

Core Viewpoint - Shenghe Jingwei Semiconductor Co., Ltd. is applying for an IPO on the Sci-Tech Innovation Board, focusing on advanced packaging and testing in the integrated circuit industry, showcasing significant growth potential and technological advancements [1][17]. Group 1: Performance Highlights - Shenghe Jingwei's revenue is projected to grow by 86.1%, 54.87%, and 38.59% from 2023 to 2025, with net profit growth rates of 110.39%, 525.99%, and 331.8% during the same period, indicating explosive growth [3][19]. - The company's sales are expected to rise from 1.633 billion yuan in 2022 to 6.521 billion yuan in 2025, establishing it as a leading player in the domestic market [3][19]. - Shenghe Jingwei achieved profitability in 2023 and anticipates a net profit of 922 million yuan by 2025, significantly outperforming comparable companies in the industry [3][19]. Group 2: Industry Trends - The global advanced packaging market is expected to reach $67.44 billion by 2029, with a compound annual growth rate (CAGR) of 10.6% from 2024 to 2029; the Chinese market is projected to reach 100.59 billion yuan with a CAGR of 14.4% during the same period [4][20]. - Recent capital expenditures by major companies in AI servers and high-end communication equipment are driving demand from downstream storage chips to upstream packaging and testing services [6][22]. Group 3: Technological Advancements - Shenghe Jingwei is a leader in the 2.5D integration field, holding an 85% market share in mainland China, and is recognized for achieving "no technological gap" with global leaders in the mid-to-high-end chip packaging sector [8][25]. - The company has pioneered 12-inch bumping technology and is the first to offer 14nm advanced process bumping services, filling gaps in China's high-end integrated circuit manufacturing chain [10][26]. - Shenghe Jingwei is actively developing 3D integration technologies, with projects aimed at scaling up production and capturing high-end market shares, aligning with the growing demand for high-performance AI chips [13][28]. Group 4: Strategic Commitment - The company has committed to self-funding initial investments in key projects if necessary, demonstrating resilience and a proactive approach to meeting market demands [14][29]. - Overall, Shenghe Jingwei's strategic focus on innovation and technology development positions it as a significant player in the semiconductor industry, particularly in the context of the Sci-Tech Innovation Board [15][29].