出品：新浪财经上市公司研究院 作者：光心 2月24日，上交所官网显示，盛合晶微半导体有限公司（下称"盛合晶微"）IPO申请通过上交所上市委审 议，成为马年首单过会的科创板IPO项目。 盛合晶微作为全球领先的集成电路晶圆级先进封测企业，其起步于12英寸中段硅片加工，后延伸至晶圆 级封装（WLP）和芯粒多芯片集成封装等先进封测服务，其营收增速和盈利能力较为出众。 2023年到2025年，盛合晶微营收同比增速分别为86.10%、54.87%、38.59%。2023年，公司实现扭亏为 盈，此后归母净利润一路成长，2025年达到9.23亿元。 此次IPO，公司拟募资48亿元，拟将募集资金投向三维多芯片集成封装项目、超高密度互联三维多芯片 集成封装项目，资金投向聚焦于多个芯粒多芯片集成封装产能，并补充配套的Bumping产能，以形成业 务增长点。 然而，公司业绩狂飙、押注产能的背后，还存在着超七成收入来自单一大客户、近四成产能闲置的潜在 风险，以及研发费用率收缩带来的前景隐患。 第一大客户的营收占比超七成 与主要客户的业务稳定性遭追问 集成电路制造业普遍存在"Turn-key"的销售模式，即芯片设计企业出于采购便利的考虑 ...

重要新闻提示 宁波富邦：预计2025年归母净利润同比增长3099.59%—4379.43% 中微半导：发布涨价通知函，决定对MCU、Norflash等产品进行价格调整，涨价幅度15%—50% 嘉事堂：股东正筹划公司控制权变更事项，今起停牌 今日提示 科创板新股恒运昌（688785）、北交所新股农大科技（920159）今日上市 鸣鸣很忙今日在港交所挂牌上市，成为港股"量贩零食第一股" 央行公开市场今日有3635亿元逆回购到期 财政部、央行：今日进行2026年中央国库现金管理商业银行定期存款（一期）招投标 国新办今日上午10时举行新闻发布会，国务院国资委副主任庞骁刚介绍2025年国资央企高质量发展情 况，并答记者问 财经新闻 1.国家统计局1月27日发布数据显示，2025年，全国规模以上工业企业实现利润总额73982亿元，比上年 增长0.6%。 2.中国人民银行1月27日消息，中国人民银行日前召开2026年反洗钱工作会议。会议要求，2026年要充 分认识反洗钱工作面临的新形势新要求，认真做好当前和今后一段时期反洗钱重点工作。 具体看，一是持续推进反洗钱条线从严治党，坚持以高水平党建引领业务工作。 二是全力做好第五 ...

1. Report Industry Investment Rating - No industry investment rating is provided in the report. 2. Core Viewpoints of the Report - The target price of Yongxi Convertible Bonds on the first - day of listing is expected to be between 128 - 133 yuan, and it is recommended to actively subscribe. The expected first - day conversion premium rate is in the range of 23% - 28%. The expected first - day new bond lottery winning rate is around 0.0074% - 0.0103% [3][20][21]. 3. Summary According to the Directory 3.1 Yongxi Convertible Bonds New Issue Analysis and Investment Recommendations 3.1.1 Convertible Bond Basic Terms Analysis - The issuance methods of Yongxi Convertible Bonds are priority placement and online issuance, with a bond and issuer rating of A+. The issuance scale is 1.165 billion yuan, the initial conversion price is 28.39 yuan, and the conversion parity on June 25, 2025, is 103.77 yuan. The calculated pure bond value is 83.7 yuan. The game terms are normal. Overall, the bond issuance scale is relatively high, the liquidity is acceptable, the rating is weak, and the bond floor protection is acceptable. It is difficult for institutions to include it in their portfolios, but there is no objection to primary participation [2][16]. 3.1.2 New Bond Initial Listing Price Analysis - The company's main business is integrated circuit packaging and testing. The main products and services include five major categories with over 2,100 mass - produced varieties. The funds raised from this issuance are mainly used for the "Multi - dimensional Heterogeneous Advanced Packaging Technology R & D and Industrialization Project", which can optimize the company's capital structure and enhance its competitiveness [3][19]. - The target price of Yongxi Convertible Bonds on the first - day of listing is 128 - 133 yuan, and it is recommended to actively subscribe. The expected first - day conversion premium rate is in the range of 23% - 28% [3][20]. 3.1.3 Convertible Bond New Issue Lottery Winning Rate Analysis - The expected first - day new bond lottery winning rate is around 0.0074% - 0.0103%. Assuming the old shareholders' placement ratio is 30% - 50%, the scale available for the market is 583 million - 816 million yuan. Referring to recent similar bond issues, the online effective subscription number is assumed to be 7.92 million households [21]. 3.2 Underlying Stock Fundamental Analysis 3.2.1 Company's Main Business and Industry Upstream and Downstream Situations - The company's main business is integrated circuit packaging and testing, with five major product categories and over 2,100 mass - produced varieties [22]. - The main upstream industries are packaging and testing raw materials and equipment industries, and the company has established good long - term cooperative relationships with many suppliers. The main downstream industry is the IC design industry, and the market scale and development speed of the downstream industry directly affect the company's sales revenue [22][23]. 3.2.2 Company's Operating Conditions - The company's recent operating income has shown an overall upward trend. From 2022 to Q1 2025, the operating income was 2.177 billion yuan, 2.391 billion yuan, 3.609 billion yuan, and 945 million yuan respectively, with year - on - year growth rates of 5.96%, 9.82%, 50.96%, and 30.12% respectively [26]. - The company's comprehensive gross profit margin has shown a fluctuating trend. From 2022 to Q1 2025, the comprehensive gross profit margin was 21.91%, 13.9%, 17.33%, and 14.19% respectively, and the net profit margins were 6.3%, - 5.65%, 1.09%, and 0.96% respectively [27]. - The company's recent period expenses have shown an upward trend, and the R & D expenses have gradually increased. The accounts receivable have shown a slight fluctuation, and the accounts receivable turnover rate has shown a slight downward trend but is at a medium level compared with the industry [31][33][36]. - The company's recent attributable net profit has shown a fluctuating trend. In 2023, the company suffered a loss, and in 2024, it turned losses into profits [40]. 3.2.3 Company's Equity Structure and Major Controlling Subsidiaries - The company's equity structure is relatively concentrated. As of June 10, 2025, the top two major shareholders hold 25.69% of the shares in total, and the top ten major shareholders hold 52.92% of the shares in total. The company's direct controlling shareholder is Yongshunxin Electronics, and the actual controller is Wang Shunbo, who holds 31.70% of the total shares. The company has 2 wholly - owned subsidiaries, 1 controlling subsidiary, and 2 affiliated companies [42][44]. 3.2.4 Company's Business Characteristics and Advantages - The company has advantages in technological innovation, talent reserve, customer cooperation, and quality assurance. It focuses on the advanced packaging field, has a large number of patents, a complete R & D system, and good cooperation with well - known design companies, and has established a quality control system [47][48][49]. 3.2.5 Allocation of Funds Raised in This Issuance - The company plans to issue convertible bonds to raise a total of no more than 1.165 billion yuan. 900 million yuan is planned to be invested in the "Multi - dimensional Heterogeneous Advanced Packaging Technology R & D and Industrialization Project", with a total investment of 1.464 billion yuan. After the project is completed, it will form an annual production capacity of 90,000 pieces of multi - dimensional heterogeneous advanced packaging products, and the project has good economic benefits [50].