专用集成电路封装

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每周股票复盘:灿瑞科技(688061)拟回购股份不低于2000万元
Sou Hu Cai Jing· 2025-09-20 20:41
截至2025年9月19日收盘,灿瑞科技(688061)报收于35.25元,较上周的34.34元上涨2.65%。本周,灿 瑞科技9月16日盘中最高价报36.93元。9月16日盘中最低价报34.75元。灿瑞科技当前最新总市值40.5亿 元,在半导体板块市值排名153/163,在两市A股市值排名3822/5153。 本周关注点 第四届监事会第十一次会议审议通过上述外汇衍生品交易议案,认为该业务有助于规避汇率波动风险, 决策程序合法合规。 此外,公司拟对部分募投项目延期及调整内部结构:"高性能传感器研发及产业化项目"预定可使用状态 日期由2025年9月调整为2027年9月,"专用集成电路封装建设项目"由2025年10月调整为2027年10月;后 者内部投资结构调整为增加场地改造费用6,700万元,相应减少设备购置费用,总投资额不变。 公司已披露截至2025年9月15日前十大股东持股情况:上海景阳投资咨询有限公司持股51,988,283股,占 比45.25%,为第一大股东;公司回购专用证券账户持股3,609,758股,占比3.14%。在前十大无限售条件 股东中,公司回购专用证券账户持股占比8.34%,位列第一。 以上内 ...
破发股灿瑞科技扣非连亏2年半 IPO募22亿中信证券保荐
Zhong Guo Jing Ji Wang· 2025-09-10 08:09
灿瑞科技首次公开发行股票募集资金总额为217,230.26万元,扣除发行费用后募集资金净额为199,997.60万 元。该公司最终募集资金净额较原计划多44,949.41万元。灿瑞科技于2022年10月13日披露的招股说明书显 示,其拟募集资金155,048.19万元,拟分别用于高性能传感器研发及产业化项目、电源管理芯片研发及产 业化项目、专用集成电路封装建设项目、研发中心建设项目和补充流动资金。 中国经济网北京9月10日讯灿瑞科技(688061.SH)2025年半年度报告显示,2025年上半年,公司营业收入为 2.94亿元,同比增长8.57%;归属于上市公司股东的净利润为-2682.35万元;归属于上市公司股东的扣除非 经常性损益后的净利润-4086.77万元;经营活动产生的现金流量净额为-5134.28万元。 | 单位 .. | | --- | | . JL | | 币种: | | 人民币 | | 主要会计数据 | 本报告期 (1-6月) | 上年同期 | 本报告期比上年 同期增减(%) | | --- | --- | --- | --- | | 营业收入 | 293, 547, 040. 65 | 27 ...
灿瑞科技: 中信证券股份有限公司关于上海灿瑞科技股份有限公司部分募集资金投资项目延期及调整内部投资结构的核查意见
Zheng Quan Zhi Xing· 2025-08-29 10:24
Core Viewpoint - The company, Shanghai Canrui Technology Co., Ltd., is adjusting the investment structure and delaying the implementation of certain fundraising projects, which is deemed a prudent decision based on the actual progress of the projects and market conditions [1][10]. Fundraising Overview - The company raised a total of RMB 217,230.26 million through the issuance of 19,276,800 shares at a price of RMB 112.69 per share, with a net amount after issuance costs being confirmed by an audit report [1][2]. Specifics of Fundraising Projects - The company has approved changes to the investment direction and implementation locations of certain fundraising projects, including the high-performance sensor R&D project and the power management chip R&D project, with adjusted investment amounts totaling RMB 241,248.49 million and RMB 200,490.44 million respectively [2][3]. Delay and Adjustment of Investment Structure - The company plans to delay the high-performance sensor R&D project and the dedicated integrated circuit packaging project, with a total investment of RMB 30,725.48 million as of August 18, 2025 [3][6]. - The delay is attributed to the need for careful planning and control of project investments, ensuring that the projects remain aligned with the company's strategic goals and market conditions [9][10]. Reasons for Project Delay - The delay is not due to any adverse conditions affecting the fundraising plan but is a strategic decision to optimize the investment outcomes and enhance efficiency [9][10]. Internal Investment Structure Adjustment - The internal investment structure for the dedicated integrated circuit packaging project is being adjusted to increase the allocation for facility renovation, which is necessary to meet growing production capacity demands [10][11]. Impact of Adjustments - The adjustments made to the fundraising projects do not change the investment purposes, total investment amounts, or implementation methods, and are not expected to adversely affect the company's normal operations [10][11]. Review Procedures and Opinions - The adjustments have been reviewed and approved by the company's board of directors and supervisory board, and will be submitted for shareholder approval [11][12].