Core Viewpoint - The article discusses the advancements in photonic chip technology as a promising solution to the challenges posed by the "post-Moore era" in semiconductor manufacturing, emphasizing the potential for significant improvements in computing power and energy efficiency [3][4][5]. Group 1: Industry Trends - The demand for enhanced intelligent computing capabilities is growing at an exponential rate, surpassing the performance improvements described by Moore's Law [2]. - The traditional electronic computing systems face significant challenges, including the "von Neumann bottleneck," slowing of Moore's Law, and the "power wall" [2]. Group 2: Photonic Chip Technology - Photonic chips utilize light as a carrier to replace electricity, offering higher bandwidth, greater parallelism, and lower energy consumption compared to electronic chips, which can lead to exponential increases in computing power [3]. - The Shanghai Jiao Tong University Wuxi Photonic Chip Research Institute (CHIPX) is a leader in the field, focusing on the development of high-end photonic chips and their industrial applications [4]. Group 3: Technological Advancements - CHIPX has established the first domestic pilot line for photonic chips, achieving low-loss and high-bandwidth performance in lithium niobate photonic chip production, with plans for large-scale production services by the end of the year [4][5]. - The research team at CHIPX has overcome technical bottlenecks in writing speeds, enabling ultra-high-density and large-capacity permanent storage using glass-based media [4]. Group 4: Future Vision - CHIPX aims to drive the fourth industrial revolution through advancements in photonic chips and quantum computing, aspiring to become a world-class center for the photonic industry [5]. - The institute has developed various advanced technologies, including DUV lithography and dry etching processes, to ensure complete control over the photonic chip manufacturing process [5]. Group 5: Industry Collaboration and Events - TrendBank plans to host the 2025 Heterogeneous Integration Annual Conference in November 2025, focusing on advanced packaging technologies and fostering collaboration between industry and academia [14]. - The conference will cover topics such as multi-material heterogeneous integration, optoelectronic co-packaging, and advanced semiconductor materials and equipment [14].