证券研究报告 公司研究 / 公司点评 2025 年 12 月 12 日 收购光学镀膜装备公司，加速关键环节国产替代 电子 / 半导体 | 报告原因： | | | --- | --- | | 买入（维持） | | | 市场数据： | 2025 年 12 月 11 日 | | 收盘价（元） | 453.10 | | 一年内最高/最低（元） | 468.00/314.33 | | 市净率 | 9.1 | | 股息率（分红/股价） | 0.17 | | 流通 A 股市值（百万元） | 327,998 | | 上证指数/深证成指 | 3,873/13,147 | | 注："股息率"以最近一年已公布分红计算 | | | 基础数据： | | | | 2025 | 年 | 09 | 月 30 | 日 | | | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | | 每股净资产（元） | | | | | | | | | 49.8 | | 资产负债率% | | | | | | | 50.90 | | | | 总股本/流通 | | A | 股（百万） | | | ...

Company Overview - New Yichang primarily engages in the research, production, and sales of intelligent manufacturing equipment, becoming a leading enterprise in the fields of semiconductor, new display packaging, and capacitor aging testing equipment in China [1] - The company achieved a revenue of 933.87 million yuan and a net profit of 40.46 million yuan in 2024, with a revenue of 226.67 million yuan and a net profit of 11.70 million yuan in the first quarter of 2025 [1] Business Development - New Yichang is expanding its product offerings through the acquisition of Kaijiu Automation and the establishment of New Yichang Feihong Technology, focusing on the research and production of semiconductor wire bonding and testing packaging equipment [1] - The company has launched several advanced packaging equipment, including semiconductor die bonders, wire bonders, and testing packaging equipment, which have received positive market and customer feedback [1] Production Capacity and Financial Health - The company has sufficient existing production capacity, and the high-end intelligent equipment manufacturing base project is progressing steadily, with plans to adjust production capacity based on market demand to maintain a high utilization rate [1] - New Yichang is actively cooperating with customers to enhance cash flow efficiency through financing leasing and expects significant cash flow improvement in 2024 [1] Market Position and Competitors - The company holds a positive outlook on the wire bonding and testing packaging equipment market, with ample orders on hand and good operational conditions [1] - Competitors include companies from the Netherlands, Japan, the United States, and Taiwan, with no current plans for overseas factories, but a continuous effort to expand overseas partnerships [1]