Core Viewpoint - New Yi Chang is positioned to benefit from the accelerating demand for LED die bonding equipment, with growth opportunities in advanced packaging and robotics, leading to a "buy" rating from analysts [1][2]. Group 1: LED Business and Market Trends - The demand for LED products is improving, driven by the expansion of LED manufacturers and the penetration of Mini/Micro LED technologies. The company is expected to see significant performance growth as a result [2][3]. - The global Mini LED market is projected to exceed $3.3 billion by 2028, with a compound annual growth rate (CAGR) of approximately 40% from 2024 to 2028. The Micro LED market is expected to surpass $10 billion by 2027 [3]. Group 2: Advanced Packaging and Robotics Expansion - The company is expanding its semiconductor die bonding machine product line and plans to introduce wire bonding and testing packaging equipment in 2025, which will enhance its product offerings [4]. - The company has developed core components such as drivers and high-precision motors in-house, creating a competitive edge in the robotics sector. This strategic shift is expected to enhance market entry and growth potential [4]. Group 3: Financial Projections - The projected net profits for New Yi Chang are estimated to be 40 million yuan in 2025, 140 million yuan in 2026, and 270 million yuan in 2027. The current stock price corresponds to price-to-earnings (PE) ratios of 196.0, 53.1, and 27.8 for the years 2025 to 2027, respectively [2][6].

Investment Rating - The investment rating for the company is "Buy" (maintained) [1] Core Views - The company is a global leader in LED die-bonding equipment and is benefiting from the expansion of LED manufacturers and the penetration of Mini/Micro LED technologies. The company is also expanding into semiconductor and robotics businesses, which is expected to open up new revenue growth opportunities. The projected net profit for 2025-2027 is estimated at 0.4/1.4/2.7 billion yuan, with corresponding PE ratios of 196.0/53.1/27.8 [6][53]. Summary by Sections LED Market Recovery and Mini/Micro LED Penetration - The LED market is recovering, with a focus on expanding Mini/Micro LED production. In the first half of 2025, there were 56 disclosed LED display-related projects with a total investment exceeding 112 billion yuan. The Mini LED global market is expected to exceed 3 billion USD by 2028, with a compound annual growth rate (CAGR) of approximately 40% from 2024 to 2028 [15][21]. Advanced Packaging and Robotics Business Expansion - The company is actively expanding its semiconductor die-bonding product line and has introduced new wire bonding and testing packaging equipment in 2025. The advanced packaging market is expected to grow significantly, driven by the demand for high-performance computing and AI chips. The global advanced packaging market is projected to reach 69.5 billion USD by 2029, with a CAGR of 11% from 2023 to 2029 [26][29]. Financial Summary and Valuation Metrics - The company's revenue is projected to grow from 1.04 billion yuan in 2023 to 1.58 billion yuan in 2027, with year-over-year growth rates of 15.3%, 17.1%, and 25.7% respectively. The gross margin is expected to improve from 30.6% in 2023 to 37.1% in 2027 [9][50]. Robotics Market Growth - The global robotics market is expected to exceed 400 billion USD by 2029, with China accounting for nearly half of this market. The company has established a new subsidiary focused on robotics and AI development, leveraging its expertise in core components and software algorithms to enhance its competitive edge in the market [41][43].

Core Viewpoint - Company ASMPT reported better-than-expected orders for Q2 2025, but profit improvement fell short of expectations, with revenue of HKD 3.4 billion (USD 436 million), a year-on-year increase of 1.8% and a quarter-on-quarter increase of 8.9% [1] Financial Performance - Q2 2025 revenue was HKD 3.4 billion (USD 436 million), with a gross margin of 39.7%, showing a year-on-year increase of 0.33 percentage points and a quarter-on-quarter decrease of 1.19 percentage points [1] - Profit for Q2 2025 was HKD 1.34 billion, a year-on-year decrease of 1.7% but a quarter-on-quarter increase of 62.5%, primarily influenced by a one-time tax credit [1] - New orders in Q2 2025 totaled USD 482 million, exceeding expectations [1] Business Segmentation - In H1 2025, 30% of revenue came from computer terminals, up from 7% in the same period of 2024, while automotive electronics accounted for 15%, down from 24% in 2024 [2] - Semiconductor revenue in Q2 2025 was USD 258 million, a quarter-on-quarter increase of 1% and a year-on-year increase of 20.9%, although orders decreased by 4.5% quarter-on-quarter and 4.6% year-on-year [2] - SMT business received USD 269 million in orders in Q2 2025, reflecting a quarter-on-quarter increase of 29.4% and a year-on-year increase of 51.2% [2] Growth Outlook - The company is experiencing growth in HBM (High Bandwidth Memory) and advanced logic, with TCB (Thermal Compression Bonding) orders increasing by 50% year-on-year in H1 2025 [1] - The company has completed equipment installations for major clients in the HBM sector and has begun small-scale production for HBM4 [1] Earnings Forecast and Valuation - The company raised its revenue forecast for 2025 by 2% to HKD 14.238 billion but lowered its profit forecast by 21% to HKD 988 million [2] - The current stock price corresponds to a P/E ratio of 26.6x for 2025 and 16.8x for 2026, with a target price of HKD 72, indicating a potential upside of 14% from the current price [2]

Company Overview - New Yichang primarily engages in the research, production, and sales of intelligent manufacturing equipment, becoming a leading enterprise in the fields of semiconductor, new display packaging, and capacitor aging testing equipment in China [1] - The company achieved a revenue of 933.87 million yuan and a net profit of 40.46 million yuan in 2024, with a revenue of 226.67 million yuan and a net profit of 11.70 million yuan in the first quarter of 2025 [1] Business Development - New Yichang is expanding its product offerings through the acquisition of Kaijiu Automation and the establishment of New Yichang Feihong Technology, focusing on the research and production of semiconductor wire bonding and testing packaging equipment [1] - The company has launched several advanced packaging equipment, including semiconductor die bonders, wire bonders, and testing packaging equipment, which have received positive market and customer feedback [1] Production Capacity and Financial Health - The company has sufficient existing production capacity, and the high-end intelligent equipment manufacturing base project is progressing steadily, with plans to adjust production capacity based on market demand to maintain a high utilization rate [1] - New Yichang is actively cooperating with customers to enhance cash flow efficiency through financing leasing and expects significant cash flow improvement in 2024 [1] Market Position and Competitors - The company holds a positive outlook on the wire bonding and testing packaging equipment market, with ample orders on hand and good operational conditions [1] - Competitors include companies from the Netherlands, Japan, the United States, and Taiwan, with no current plans for overseas factories, but a continuous effort to expand overseas partnerships [1]