Core Viewpoint - TSMC is advancing to the next generation of semiconductor manufacturing with a focus on 2nm and below processes, opting for cost-effective solutions like photomask pellicles instead of investing in expensive High-NA EUV equipment [1][2][4]. Group 1: Technology and Production Plans - TSMC's 2nm wafers are expected to enter mass production by the end of 2025, followed by the 1.4nm node around 2028, with an investment of NT$1.5 trillion (approximately $49 billion) [1]. - The company has initiated R&D for the 1.4nm process at its Hsinchu facility and has procured 30 standard EUV machines to meet demand from clients like Apple [2][4]. - TSMC's A14 process, which is based on second-generation GAA transistors, is projected to achieve a performance improvement of up to 15% at the same power consumption, or a 25% to 30% reduction in power consumption at the same frequency [4][5]. Group 2: Cost Management and Strategic Decisions - TSMC has chosen not to purchase High-NA EUV equipment, which costs up to $400 million per unit, citing that the cost does not justify the benefits [2][4]. - The use of photomask pellicles is seen as a more cost-effective alternative, despite the challenges it presents in terms of increased exposure steps and potential impacts on yield [2][5]. - TSMC's strategy emphasizes maximizing returns on investment by delaying the adoption of High-NA EUV until it can provide meaningful, quantifiable benefits [6]. Group 3: Competitive Positioning - Unlike Intel, which plans to introduce High-NA EUV in its 14A process around 2027-2028, TSMC does not anticipate using this technology in mass production until at least 2030 [6]. - TSMC's approach allows it to maintain predictable yields and performance characteristics without relying on the latest EUV technology [5][6].