证券日报网讯12月29日，龙图光罩在互动平台回答投资者提问时表示，关于多重曝光技术，其在理论上 确实可以通过图形分解和多次图案化流程，利用相对成熟的掩模版技术来支持更先进的芯片制程，但晶 圆厂的潜在成本和工艺难度极高。掩模版的制程节点(如"40nm掩模版")并非直接指其自身图形的最小物 理线宽，而是指它能够稳定支持下游晶圆厂制造的芯片工艺节点。公司目前已完成40nm工艺节点的生 产设备布局，并正积极推进65nm产品的送样以及90nm节点产品的量产导入。在产能建设方面，珠海募 投项目已于2025年第二季度开始小规模量产，目前正处于产能爬坡与市场拓展的关键阶段，公司正致力 于加速产能利用率的提升与客户合作的深化。关于公司各项业务的具体进展，请以官方披露的定期报告 或临时公告为准。 ...

格隆汇12月29日丨龙图光罩(688721.SH)在投资者互动平台表示，关于多重曝光技术，其在理论上确实 可以通过图形分解和多次图案化流程，利用相对成熟的掩模版技术来支持更先进的芯片制程，但晶圆厂 的潜在成本和工艺难度极高。掩模版的制程节点（如"40nm掩模版"）并非直接指其自身图形的最小物 理线宽，而是指它能够稳定支持下游晶圆厂制造的芯片工艺节点。公司目前已完成40nm工艺节点的生 产设备布局，并正积极推进65nm产品的送样以及90nm节点产品的量产导入。在产能建设方面，珠海募 投项目已于2025年第二季度开始小规模量产，目前正处于产能爬坡与市场拓展的关键阶段，公司正致力 于加速产能利用率的提升与客户合作的深化。关于公司各项业务的具体进展，请以官方披露的定期报告 或临时公告为准。 ...

Core Viewpoint - TSMC is advancing to the next generation of semiconductor manufacturing with a focus on 2nm and below processes, opting for cost-effective solutions like photomask pellicles instead of investing in expensive High-NA EUV equipment [1][2][4]. Group 1: Technology and Production Plans - TSMC's 2nm wafers are expected to enter mass production by the end of 2025, followed by the 1.4nm node around 2028, with an investment of NT$1.5 trillion (approximately $49 billion) [1]. - The company has initiated R&D for the 1.4nm process at its Hsinchu facility and has procured 30 standard EUV machines to meet demand from clients like Apple [2][4]. - TSMC's A14 process, which is based on second-generation GAA transistors, is projected to achieve a performance improvement of up to 15% at the same power consumption, or a 25% to 30% reduction in power consumption at the same frequency [4][5]. Group 2: Cost Management and Strategic Decisions - TSMC has chosen not to purchase High-NA EUV equipment, which costs up to $400 million per unit, citing that the cost does not justify the benefits [2][4]. - The use of photomask pellicles is seen as a more cost-effective alternative, despite the challenges it presents in terms of increased exposure steps and potential impacts on yield [2][5]. - TSMC's strategy emphasizes maximizing returns on investment by delaying the adoption of High-NA EUV until it can provide meaningful, quantifiable benefits [6]. Group 3: Competitive Positioning - Unlike Intel, which plans to introduce High-NA EUV in its 14A process around 2027-2028, TSMC does not anticipate using this technology in mass production until at least 2030 [6]. - TSMC's approach allows it to maintain predictable yields and performance characteristics without relying on the latest EUV technology [5][6].