Core Insights - The profits of South Korean wafer fabrication equipment manufacturers significantly increased last year, driven by high bandwidth memory (HBM) and advanced packaging technologies [1] Group 1: Revenue Growth - Hanmi Semiconductor reported the highest year-on-year revenue growth at 638.15%, followed by Techwing at 631.25%, and Zeus at 592.96% [1] - The revenue of Hanmi Semiconductor reached 558.9 billion KRW, with an operating profit of 255.4 billion KRW [1] Group 2: Key Suppliers and Clients - Hanmi Semiconductor is the primary supplier of thermal compression (TC) bonders for HBM production to SK Hynix, the largest HBM supplier globally [2] - Techwing's revenue was 185.5 billion KRW, with an operating profit of 23.4 billion KRW, serving major clients like SK Hynix, Kioxia, and Micron [2] - Zeus generated revenue of 490.8 billion KRW, with an operating income of 49.2 billion KRW, supplying TSV cleaning machines to Samsung and SK Hynix [3] Group 3: Market Dynamics - Jusung Engineering's revenue was 409.4 billion KRW, with 85% coming from China, indicating a strong demand in the Chinese market despite potential risks from the US-China trade war [3] - DIT reported revenue of 116.7 billion KRW, with 59% of its income derived from laser solutions, primarily serving SK Hynix [3] Group 4: New Developments - Auros Technology's revenue was 61.4 billion KRW, and it began supplying overlay measurement equipment to Kioxia in mid-2024 [4]