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别克逍遥架构新一代智舱
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智慧新体验 别克逍遥架构新一代智舱将搭载高通SA8775P芯片
Core Insights - SAIC-GM announced a strategic partnership with Qualcomm and Bosch to celebrate the successful rollout of a sample intelligent cockpit domain controller based on Qualcomm's SA8775P chip [1][3] - The technology will be applied to the Buick Xiaoyao super-integrated vehicle architecture, with plans for mass production in the second half of the year for the first sedan under Buick's high-end new energy sub-brand "Zhijing" [1] Group 1 - The Qualcomm SA8775P chip is a next-generation computing platform designed specifically for smart vehicles, offering up to 72 TOPS of neural network computing power [3] - This chip serves as a strong computational foundation for the new generation of intelligent cockpits in the Buick Xiaoyao architecture, redefining human-machine interaction experiences [3] - The SA8775P chip integrates the Adreno 663 GPU, providing excellent ultra-high-definition rendering capabilities, enhancing the visual performance of instrument screens, central control screens, and entertainment screens [3] Group 2 - The AI acceleration unit of the SA8775P chip allows the intelligent cockpit system of the Buick Xiaoyao architecture to efficiently deploy larger parameter-scale multimodal edge models [3] - This capability significantly reduces service response latency, providing users with a faster experience while ensuring data processing is completed locally to protect user privacy [3] - The powerful AI computing capability enhances the multimodal interaction ability of the intelligent cockpit, integrating touch, voice, and visual perception-based occupant monitoring (OMS) and driver monitoring (DMS) for diverse and natural interaction methods [3]