功率半导体封装浆料
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【科技自立·产业自强】帝科股份:以技术创新,服务国家新能源与半导体战略自主自强
Zheng Quan Shi Bao Wang· 2025-10-06 05:16
Core Viewpoint - Dike Co., Ltd. (300842) is focusing on breakthroughs in domestic alternatives for power semiconductor packaging materials and automotive electronic materials to challenge the monopolies of companies like Henkel, Heraeus, and Alpha [1] Group 1: Company Strategy - Dike Co., Ltd. aims to achieve coordinated development between semiconductor packaging materials and semiconductor devices [1] - In 2024, the company plans to introduce a senior team from the memory semiconductor industry to enter the core field of memory [1] - The new team specializes in the application development and design of DRAM memory chips, which will leverage unique technological advantages [1] Group 2: Industry Impact - The initiative is expected to help break foreign monopolies in the memory industry and promote rapid development of the domestic memory sector [1] - The domestic memory industry is anticipated to meet the growing demand for memory chips driven by core strategic areas such as AI, big data, 5G, and autonomous driving [1]