责任编辑：小浪快报 声明：市场有风险，投资需谨慎。本文为AI大模型基于第三方数据库自动发布，任何在本文出现的信 息（包括但不限于个股、评论、预测、图表、指标、理论、任何形式的表述等）均只作为参考，不构成 个人投资建议。受限于第三方数据库质量等问题，我们无法对数据的真实性及完整性进行分辨或核验， 因此本文内容可能出现不准确、不完整、误导性的内容或信息，具体以公司公告为准。如有疑问，请联 系biz@staff.sina.com.cn。 2026年1月21日，金太阳（sz300606）触及涨停，涨停价39.14元，涨幅19.99%，总市值54.15亿元，流通 市值46.06亿元，截止发稿，总成交额16.00亿元。 根据喜娜AI异动分析，金太阳涨停原因可能如下，半导体抛光液+技术研发突破+业绩增长： 1、公司核 心产品半导体抛光液验证通过并实现量产，获得头部FAB厂订单，标志着国产替代取得突破，将直接贡 献业绩增量。同时，公司技术研发取得突破，获得多项发明专利，涉及磨料新材料和制备工艺创新，提 升了核心竞争力。 2、2025年三季报显示，公司扣非净利润同比增长126.9%，主营业务盈利能力显著增 强，经营活动现金流净 ...

Core Insights - The semiconductor polishing liquid is a critical consumable in the chemical mechanical polishing (CMP) process, essential for achieving global planarization of wafer surfaces through chemical etching and mechanical grinding [1][8] - The global market for CMP polishing liquids is projected to reach $3.2 billion in 2024, surpassing $3.5 billion in 2025, and is expected to reach $4.5 billion by 2028, driven by the upgrade of the optoelectronic industry and the expansion of third-generation semiconductor applications [1][8] - In China, the market for semiconductor polishing liquids is anticipated to grow from approximately 6 billion yuan in 2024 to 10.5 billion yuan by 2028, with domestic companies like Anji Technology and Dinglong Co. making significant breakthroughs [1][8] Industry Overview - Semiconductor polishing liquids, composed of nano-sized abrasives, oxidizers, complexing agents, and deionized water, are designed to achieve micron or nano-level precision removal of materials such as silicon, copper, and tungsten [2][3] - The industry is characterized by a dual structure of overseas dominance and domestic breakthroughs, with foreign companies leading in high-end markets while local firms strive to catch up [1][9] Policy Background - China has implemented multiple policies to support the domestic semiconductor polishing liquid industry, focusing on R&D support, capacity building, standardization, and application promotion [4][5] Industry Chain - The semiconductor polishing liquid industry chain includes upstream raw materials (abrasives, oxidizers), midstream production (companies like Anji Technology and Dinglong Co.), and downstream consumption primarily in integrated circuit manufacturing [5][6] - The integrated circuit manufacturing sector is the core consumer market, with significant demand driven by advancements in logic and memory chips [6] Market Dynamics - The advanced packaging sector is emerging as a key growth driver for the semiconductor polishing liquid market, with the market size expected to exceed 110 billion yuan by 2025, reflecting a compound annual growth rate of 25.6% [6][7] - The demand for specialized polishing liquids is increasing due to the stringent requirements of new chip structures and advanced packaging technologies [6][7] Competitive Landscape - The Chinese semiconductor polishing liquid market is dominated by international players like Cabot and Hitachi, while local companies such as Anji Technology and Dinglong Co. are making strides in market share and technological advancements [9][10] - Anji Technology leads with over 40% market share in copper polishing liquids, while Dinglong Co. has a nearly 30% share in polishing pads [9][10] Future Trends - The industry is expected to focus on technological advancements, supply chain autonomy, and green transformation, with an emphasis on developing low-defect formulations for advanced processes [11][12] - Companies will prioritize the development of customized products for emerging applications, while also addressing the challenges of high-purity raw material production [11][12] - Environmental considerations will drive the development of eco-friendly polishing liquids and sustainable manufacturing processes [13]