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半导体芯片先进封装用覆铜陶瓷基板
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惠山区前洲街道“腾笼换鸟”集聚“芯生态”
Xin Hua Ri Bao· 2026-02-07 20:31
"硬改"加"软装",满足"芯"的需求 签约是项目落地的第一步,筑好"芯"巢才能留住"新凤"。"留住企业靠的是实打实的用心。半导体项目 对载体空间有着特殊需求,不能简单地腾挪空间,而是要重构载体的功能。"项目相关负责人说,从原 轻工类厂房改造为半导体电子类厂房,在洁净、污水处理、安全间距、电气管路铺设等方面都需进行复 杂重构。 在工期紧张、任务繁重等情况下,前洲街道与企业、设计方迅速开展多轮高效的方案研判和可行性研 究,确定了对载体进行功能性提升改造的最优方案。2025年9月,一场复杂的集成式"爆改"全面展开: 室外新建专用污水处理池与仓库;室内全面墙顶地改造、消防改造等工程并线进行。同时,为满足项目 方加速投产需求,多个工程任务与项目方的二次配工程穿插作业、配合紧密。 在"软服务"上,政府成立由多部门组成的项目专班,为项目落地提供全面可靠的支撑。"吸引我们的, 不仅是现成的、经过评估可改造的载体,更重要的是无锡一流的营商环境。"江丰同芯相关负责人说, 从落地签约到工程实施,项目专班为他们提供了载体匹配、手续办理、审批环节的全流程服务,正式施 工后还建立了动态跟踪机制,及时破解推进过程中的难点堵点。 以商引商, ...
无锡总投资5亿的芯片项目迎新进展,5月有望投产测试
Yang Zi Wan Bao Wang· 2026-01-30 13:07
Core Viewpoint - The project led by Jiangfeng Tongxin aims to establish a production base for advanced packaging of copper-clad ceramic substrates, reflecting a strategic shift in the semiconductor industry in Wuxi, China, to revitalize idle assets and promote industrial upgrades [1][3][5]. Group 1: Project Overview - Jiangfeng Tongxin's project will produce 7.2 million semiconductor chips annually, with a total investment of 500 million yuan (approximately 70 million USD) [5][6]. - The project is part of a broader initiative to transform idle industrial spaces into hubs for advanced semiconductor manufacturing, addressing the needs of the third-generation semiconductor industry [3][5]. Group 2: Economic Impact - The project is expected to generate annual revenue of 500 million yuan (approximately 70 million USD) once fully operational, contributing to domestic production and reducing reliance on imports [6][7]. - The presence of Jiangfeng Tongxin is attracting upstream and downstream semiconductor-related companies, indicating a chain reaction of investment and collaboration within the industry [7]. Group 3: Infrastructure Development - Significant modifications are being made to the existing facilities to meet the specific requirements of semiconductor manufacturing, including cleanroom standards and wastewater treatment [6]. - The project is on track for production testing by May 2024, with ongoing construction and infrastructure improvements [6].