Core Insights - The company reported a revenue of 3.45 billion yuan, representing a year-on-year increase of 20.58% [3] - Net profit attributable to shareholders reached 601 million yuan, up 41.55% compared to the previous year [3] - The company has increased its investment in the third-generation semiconductor chip industry, particularly in SiC power devices [2] Financial Performance - Revenue for the reporting period was 3,454,861,057.06 yuan, compared to 2,865,255,202.25 yuan in the same period last year, marking a growth of 20.58% [3] - Net profit attributable to shareholders was 601,345,162.23 yuan, up from 424,843,451.68 yuan, reflecting a 41.55% increase [3] - The net profit after deducting non-recurring gains and losses was 559,030,742.52 yuan, a rise of 32.33% from 422,451,942.72 yuan [3] - The net cash flow from operating activities was 757,490,803.53 yuan, an increase of 43.43% from 528,137,435.41 yuan [3] - Basic and diluted earnings per share were both 1.12 yuan, up 43.59% from 0.78 yuan [3] - The weighted average return on equity was 6.63%, compared to 5.03% in the previous year [3] Industry Trends - The semiconductor industry continues to experience growth, particularly in automotive electronics, artificial intelligence, and consumer electronics, driving the company's main business growth [1] - The company has integrated lean production concepts into its power semiconductor production processes, enhancing operational efficiency through process optimization and cost management [1] Product Development - The company has increased its focus on third-generation semiconductor chips, particularly SiC MOS products, which have been upgraded from second to third generation [2] - The SiC chip factory has achieved product coverage for 650V, 1200V, and 1700V with resistance ranging from 13mΩ to 500mΩ [2] - The company has developed an automated production line for automotive power modules, capable of producing 168,000 three-phase bridge HPD modules annually [4] - Key technologies such as low parasitic inductance and direct water cooling have been researched for high power density and low thermal resistance applications [4] - The company has filed for 15 intellectual property rights during the reporting period, including 9 domestic invention patents [4]