Group 1 - Xiamen Bank has successfully issued the "Xiamen Bank Co., Ltd. 2025 First Phase Technology Innovation Bond" in the national interbank bond market [2] - The bond was recorded on September 10, 2025, and completed issuance on September 12, 2025 [2] - The total issuance scale of the bond is RMB 1 billion, with a fixed interest rate of 1.90% for a term of 5 years [2]

Group 1 - The core point of the article is that Xiamen Bank has successfully issued its first phase of technology innovation bonds for 2025, approved by the People's Bank of China [1] - The bond issuance took place on September 12, 2025, with a total scale of RMB 1 billion and a fixed interest rate of 1.90% over a 5-year term [1] - The funds raised from this bond will be allocated to the technology innovation sector as outlined in the "Five Major Articles of Finance" statistical system, including technology loans and investments in bonds issued by technology innovation enterprises [1]