Group 1 - The company has laid out plans for a detachable ultra-thin copper foil project, with product samples already sent for testing [1] - Construction of the factory and related equipment is progressing in an orderly manner, with an expected production capacity of 700,000 square meters per year of ultra-thin copper foil for chip packaging by the end of 2026 [1] - The company will continue to increase research and development efforts for this type of copper foil and actively promote market expansion [1]

每经AI快讯，7月30日，嘉元科技在互动平台表示，公司已布局可剥离超薄铜箔相关项目，产品已送样 测试。目前厂房建设及相关设备正有序推进中，预计2026年底可实现芯片封装用极薄铜箔70万平方米/ 年。 ...