Core Insights - The article highlights the advancements and competitive strategies of Jia Yuan Technology in the copper foil industry, emphasizing their focus on ultra-thin and high-performance products [2][3]. Group 1: Product Development and Innovation - Jia Yuan Technology has developed ultra-thin copper foil with a thickness of only 4.5 micrometers, achieving a tensile strength of up to 800 MPa and an elongation rate of 20%, which enhances battery energy density by 10% [2]. - The company has invested significantly in R&D, with a team of 318 members, and has increased R&D spending to 330 million yuan, a year-on-year growth of 46.56% [3]. - Jia Yuan Technology has successfully developed high-end products such as ultra-high-strength copper foil and double-sided nickel-plated copper foil, which are now in mass production [4]. Group 2: Strategic Partnerships and Market Expansion - The company is enhancing its supply chain stability by forming deep partnerships with upstream copper material suppliers and establishing long-term relationships with major downstream clients, including a framework agreement with CATL to supply at least 626,000 tons of copper foil from 2026 to 2028 [3]. - Jia Yuan Technology is actively expanding into international markets, targeting regions such as Japan, South Korea, Southeast Asia, and Europe, with plans to supply lithium battery copper foil products to overseas clients starting from July 2024 [5]. - The company has a total annual production capacity exceeding 130,000 tons, with strong demand for high-performance copper foil products from overseas clients [5]. Group 3: Focus on Emerging Technologies - Jia Yuan Technology is positioning itself in the AI sector by developing high-performance copper foil for PCB applications, which are essential for AI hardware [5][6]. - The company is working on innovative products such as HVLP (ultra-low profile copper foil) and RTF (reverse copper foil), which are currently in the customer validation phase [6]. - Jia Yuan Technology aims to capture new growth opportunities by focusing on high-end, differentiated products that meet the demands of emerging fields like AI and computing power [6].

Group 1 - The company has laid out plans for a detachable ultra-thin copper foil project, with product samples already sent for testing [1] - Construction of the factory and related equipment is progressing in an orderly manner, with an expected production capacity of 700,000 square meters per year of ultra-thin copper foil for chip packaging by the end of 2026 [1] - The company will continue to increase research and development efforts for this type of copper foil and actively promote market expansion [1]

每经AI快讯，7月30日，嘉元科技在互动平台表示，公司已布局可剥离超薄铜箔相关项目，产品已送样 测试。目前厂房建设及相关设备正有序推进中，预计2026年底可实现芯片封装用极薄铜箔70万平方米/ 年。 ...