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中微半导实控人拟询价转让套现4亿 2022上市超募10.9亿
Zhong Guo Jing Ji Wang· 2026-02-26 02:39
中微半导于2022年8月5日在上交所科创板上市,发行数量为6,300.00万股,发行价格为30.86元/ 股,保荐机构(主承销商)中信证券股份有限公司,保荐代表人为许艺彬、王彬。 中国经济网北京2月26日讯 中微半导(688380.SH)昨日晚间披露股东询价转让计划书,公司股东周彦 委托中国国际金融股份有限公司(以下简称"中金公司")组织实施本次询价转让,拟转让股份的总数为 8,007,300股,占公司总股本的比例为2.00%。 本次询价转让为非公开转让,不通过集中竞价交易方式或大宗交易方式进行,不属于通过二级市场 减持。受让方通过询价转让受让的股份,在受让后6个月内不得转让。本次询价转让的受让方为具备相 应定价能力和风险承受能力的机构投资者。 按照中微半导2月25日收盘价50.97元计算,周彦本次询价转让金额约合4.08亿元。 2019年至2024年,中微半导营业收入分别为2.45亿元、3.78亿元、11.09亿元、6.37亿元、7.14亿 元、9.12亿元,归属于上市公司股东的净利润分别为0.25亿元、0.94亿元、7.85亿元、0.59亿元、-0.22亿 元、1.37亿元,归属于上市公司股东的扣除非经常 ...
中微半导:拟将募投项目结项,12083.43万元节余资金用于永久补充流动资金
2 1 Shi Ji Jing Ji Bao Dao· 2026-02-11 11:14
Core Viewpoint - The company has completed three major projects related to chip development and has approved the conclusion of these projects during the board meeting held on February 11, 2026 [1] Group 1: Project Completion - The company announced the completion of the "Home Appliances and Industrial Control MCU Chip Development and Industrialization Project," "IoT SOC and Analog Chip Development and Industrialization Project," and "Automotive Grade Chip Development Project" [1] - All three projects have been implemented and reached the predetermined usable status as of December 31, 2025 [1] Group 2: Financial Summary - As of December 31, 2025, the total surplus of raised funds from the three projects amounts to 220.8343 million yuan, after deducting payable amounts of 2.8309 million yuan [1] - Out of the surplus funds, 120.8343 million yuan is intended for permanent replenishment of working capital, while 100 million yuan is earmarked for investment in new projects [1] - Following the transfer of the raised funds, the relevant special account for the raised funds will be canceled [1]
中微半导拟发H股 A股超募11亿上市见顶前一年业绩巅峰
Zhong Guo Jing Ji Wang· 2025-07-23 06:48
Core Viewpoint - The company, Zhongwei Semiconductor (688380.SH), plans to issue H-shares and apply for listing on the Hong Kong Stock Exchange to enhance its global strategy, diversify financing channels, and improve its core competitiveness [1]. Group 1: H-Share Issuance - The company aims to issue H-shares to deepen its global strategy and enhance its international brand image [1]. - The issuance is subject to approval from the shareholders' meeting and relevant regulatory bodies, including the China Securities Regulatory Commission and the Hong Kong Stock Exchange [1][2]. - The company is currently in discussions with intermediaries regarding the H-share issuance and listing [1]. Group 2: Financial Performance - Zhongwei Semiconductor was listed on the Shanghai Stock Exchange's Sci-Tech Innovation Board on August 5, 2022, with an issuance of 63 million shares at a price of 30.86 yuan per share [2]. - The company raised a total of 194.42 million yuan, with a net amount of 181.65 million yuan after deducting issuance costs [3]. - The net fundraising exceeded the initial plan by 108.77 million yuan, which was intended for various R&D projects and working capital [3]. Group 3: Historical Financial Data - The company's revenue from 2019 to 2024 was 245 million yuan, 378 million yuan, 1.11 billion yuan, 637 million yuan, 714 million yuan, and 912 million yuan, respectively [5]. - The net profit attributable to shareholders during the same period was 25 million yuan, 94 million yuan, 785 million yuan, 59 million yuan, -22 million yuan, and 137 million yuan [5]. - The company reached its peak performance in 2021, with significant fluctuations in revenue and profit in subsequent years [5].