Core Viewpoint - The company is focusing on the photovoltaic silicon wafer cutting segment, leveraging its "equipment + consumables + process" technology closed-loop advantage to lead the thin wafer trend in the industry [1] Group 1: Product Development - In 2022, the company launched an 80μm ultra-thin silicon wafer, followed by a 60μm ultra-thin silicon wafer in 2023, and recently introduced a 50μm ultra-thin silicon wafer [1] - The demand for ultra-thin silicon wafers is expected to grow with the application of space photovoltaic ultra-thin flexible HJT batteries [1] Group 2: Technical Barriers and Industry Position - The cutting technology for ultra-thin silicon wafers has relatively high technical barriers, requiring advanced cutting equipment, diamond wires, and cutting processes [1] - The company has laid out and planned a path for continuous improvement in the yield of ultra-thin silicon wafers, aiding the industry in accelerating the mass production pace of ultra-thin silicon wafers [1]

格隆汇1月28日丨高测股份(688556.SH)在投资者互动平台表示，公司深耕光伏硅片切割细分领域，充分 发挥"设备+耗材+工艺"技术闭环优势，持续引领硅片薄片化进程。2022年公司首发80μm超薄硅片， 2023年首发60μm超薄硅片，并已在近期推出50μm超薄硅片。超薄硅片的需求预计将随着太空光伏超薄 柔性HJT电池的应用逐步打开。超薄硅片切割技术壁垒相对较高，对切割设备、金刚线及切割工艺都提 出了更高要求，公司已布局并规划超薄硅片良率持续提升路径，助力行业加快超薄硅片量产节奏。 ...