证券日报网讯 1月28日，气派科技在互动平台回答投资者提问时表示，公司具备存储芯片的封装能力， 公司同时在该类产品的封装技术上不断投入研发。 （文章来源：证券日报） ...

Core Viewpoint - The announcement highlights the high technical barriers in the storage chip packaging industry, emphasizing the company's leadership position in high-end storage chip testing and packaging in China [1] Group 1: Company Capabilities - The company possesses a highly experienced R&D and engineering team, which is crucial for maintaining its competitive edge in the industry [1] - The company has advanced multi-layer stacking packaging technology and software development capabilities for testing [1] Group 2: Production Status - The company's packaging facilities in Shenzhen and Hefei are currently operating at full capacity [1] - The company is expanding production in response to recent customer demand [1]