Core Viewpoint - The research team from Tianjin University has developed a groundbreaking method for non-destructive testing of micro-LED wafers, addressing significant challenges in the production and quality assurance of next-generation display technologies [1][2]. Group 1: Technology Development - The team introduced a novel non-destructive testing method using a flexible probe system, which can adapt to the micro-scale variations of the wafer surface with a gentle pressure of only 0.9 MPa [2]. - This flexible probe system, composed of an elastic micro-pillar array and extendable electrodes, demonstrates remarkable durability, maintaining functionality after 1 million contacts, which is ten times longer than traditional rigid probes [2][3]. - The unique three-dimensional pressure-reducing structure of the probe ensures that internal stress remains safe and controllable even under extreme deformation [2]. Group 2: System Integration - An intelligent detection system was developed to complement the flexible probes, ensuring perfect alignment with the wafer and enabling real-time capture of LED activation states while measuring electrical parameters and contact pressure [2][3]. - The system includes a spherical leveling device that guarantees parallelism between the probe and the wafer, enhancing measurement accuracy [2]. Group 3: Industry Impact - The research has led to the creation of a high-density flexible probe array capable of handling ultra-small dimensions of 10×30 micrometers, paving the way for next-generation high-speed wafer testing [3]. - The technology addresses critical pain points in the LED industry and opens new pathways for complex wafer testing, with plans for industrialization to provide cost-effective testing solutions for the domestic LED sector [3]. - Additionally, this advancement lays the groundwork for improving yield rates in high-end display panels used in augmented reality (AR) and virtual reality (VR) applications [3].

微型LED是下一代高端显示技术的核心元件，搭载微型LED的晶圆必须达到100%的良率，否则将会给 终端产品造成巨大的修复成本。然而，业界却一直没有找到晶圆接触式无损检测的好方法。近日，我国科 研人员用"以柔克刚"的方式填补了这一技术空白。 传统的晶圆良率检测方法有的如"铁笔刻玉"，会造成晶圆表面不可逆的物理损伤；有的则只能"观其大 概"，存在较高的漏检率和错检率。良率无损检测的技术空白严重阻碍了大面积显示屏、柔性显示屏等微型 LED终端产品的量产。 近日，天津大学精密测试技术及仪器全国重点实验室、精仪学院感知科学与工程系黄显教授团队打破 了微型LED晶圆测试瓶颈，实现了微型LED晶圆高通量无损测试，研究成果于13日在国际学术期刊《自然- 电子学》刊发。 图为测试系统中的柔性探针，当探针接触LED晶圆后点亮其中的一个LED发出蓝色光，通过同轴光路 可观察光强和波长信息。（受访者供图） "我们实现了从零到一的突破，填补了微型LED电致发光检测的技术空白，也为其他复杂晶圆检测提供 了革命性技术方案，随着探针阵列规模与检测通道的持续拓展，未来或将在晶圆级集成检测、生物光子学 等领域产生更广泛影响。"黄显说。 据悉，目 ...