Core Viewpoint - The article discusses the rapid increase in data center rack density driven by the demands of artificial intelligence and high-performance computing, leading to higher power consumption and heat generation, which traditional cooling methods struggle to manage [2][4]. Group 1: Rack Power Consumption - Average power per rack has increased from 6 kW eight years ago to 270 kW currently, with projections of 480 kW racks next year and megawatt-level racks within two years [2]. - The cooling infrastructure is challenged to keep pace with this increase in power requirements [2]. Group 2: Microfluidic Cooling Technology - Corintis is developing microfluidic technology that delivers cooling liquids directly to specific areas of chips, significantly improving cooling efficiency [2][4]. - In tests with Microsoft, servers running Teams showed three times the cooling efficiency compared to existing methods, with microfluidic technology reducing chip temperatures by over 80% compared to traditional air cooling [2][4]. Group 3: Environmental Impact and Water Usage - Current industry standards require approximately 1.5 liters of water per kW per minute for cooling, which could escalate to 15 liters per minute for chips nearing 10 kW, raising environmental concerns [4]. - Corintis aims to optimize liquid cooling to ensure efficient use of water, addressing community concerns regarding large AI facilities [4]. Group 4: Design and Manufacturing Innovations - Corintis has expanded its additive manufacturing capabilities to produce copper components with microchannels as small as 70 microns, compatible with existing liquid cooling systems [4][5]. - The company believes that collaborating directly with chip manufacturers to etch channels on silicon wafers could lead to a tenfold improvement in cooling performance [5]. Group 5: Future Directions - The goal is to integrate cooling systems directly with chip designs, addressing thermal transfer bottlenecks [8]. - Corintis has produced over 10,000 copper cold plates and aims to reach an annual production of 1 million by the end of 2026, while also developing internal cooling channels within chips [8]. - The company has announced plans for expansion in the U.S. and Germany, alongside a $24 million Series A funding round led by BlueYard Capital [8].