Core Insights - The Beijing Financial Assets Exchange (北金所) has launched a "Technology Board" to support the issuance of technology innovation bonds, facilitating a total of 38 bond issuances with a financing scale exceeding 21.5 billion yuan as of May 13 [1][3] - The exchange has introduced a dynamic issuance system and a multi-faceted information service platform to ensure the smooth operation of the "Technology Board" [1][2] - A recent online and offline event attracted over 100 institutions, showcasing 36 technology enterprises and enhancing visibility for quality companies [2] Group 1 - The "Technology Board" has successfully supported the issuance of 38 technology innovation bonds, raising over 21.5 billion yuan, thereby channeling financial resources into innovative sectors [1][3] - The exchange has established a dedicated issuance area for technology innovation bonds, providing real-time access to all issuance information and enhancing operational efficiency through a transparent and secure system [1][2] - The first batch of technology innovation bonds included 76 million yuan issued by private enterprises, with an average subscription multiple of 1.96, indicating strong market recognition of investment value in private tech enterprises [3] Group 2 - The launch of the financing exchange platform has facilitated four roadshow events covering 32 enterprises and over 360 investment institutions, effectively connecting quality enterprises with investment needs [2] - The exchange's strategy integrates issuers, intermediaries, and investors, creating a comprehensive service ecosystem that enhances efficiency across financing, underwriting, and investment processes [2] - The issuance of a 10 billion yuan technology innovation special financial bond by Industrial Bank was successfully completed, with funds allocated specifically for technology innovation loans, attracting diverse institutional investors [3]