据美国白宫官网消息，当地时间1月2日，美国总统唐纳德·特朗普以"保护国家安全"为由签署了一项行政令，要求撤销一项价值2.92亿美元的中资企业 HieFo收购美国芯片公司EMCORE的交易。HieFo必须在180天内剥离Emcore资产的所有权益和权利。 HieFo公司则是由Genzao Zhang博士和Harry Moore创立。Genzao Zhang曾任Emcore工程副总裁，后来成为HieFo首席执行官。 2024年9月，HieFo宣布已完成收购EMCORE非核心已停产芯片业务线及InP（磷化铟）晶圆制造业务的几乎所有资产。该交易于2024年4月30日完成，包 括从EMCORE位于加利福尼亚阿罕布拉的设施转移设备、合同、知识产权和库存。 根据协议，HieFo将最初转租阿罕布拉场地的一整栋建筑和另一栋建筑的一部分，最终从2024年7月1日起租赁两栋完整建筑，并按比例支付租金。同时， HieFo成功聘请了 EMCORE 已停产芯片业务中几乎所有关键科学家、工程师和运营人员，并将继续在现有的 Alhambra 园区运营。 HieFo首席执行官、前EMCORE工程副总裁Genzao Zhang博士表示："通过利 ...

Core Viewpoint - The article discusses the recent intervention by the Trump administration requiring the Chinese-controlled U.S. company HieFo to divest its semiconductor assets, highlighting a systematic trend of the U.S. and its allies to curb Chinese semiconductor enterprises' overseas expansion [1][8]. Group 1: HieFo Acquisition Background - HieFo acquired EMCORE's digital chip and related wafer design, manufacturing, and processing business for approximately $2.92 million on April 30, 2024, as EMCORE faced severe operational pressures due to continuous losses in 2023 [3]. - EMCORE's core products, which include critical components for the U.S. military, embedded the company deeply within the defense supply chain, setting the stage for potential U.S. government intervention [3]. Group 2: U.S. Government Intervention - The intervention was triggered by HieFo's ownership structure, with control held by a Chinese national who previously served as EMCORE's engineering vice president. The U.S. claimed that HieFo did not proactively report the acquisition to the Committee on Foreign Investment in the United States (CFIUS) [4]. - CFIUS utilized enhanced monitoring powers under the Foreign Investment Risk Review Modernization Act (FIRRMA) to initiate a review of the non-reported transaction, revealing the expanded authority of CFIUS to retroactively review completed transactions [4]. Group 3: Broader Implications and Patterns - The HieFo incident is part of a broader pattern of interventions, including the Netherlands' ASML semiconductor case and the UK's FTDI equity divestment, all of which share a common theme of using "national security" as a pretext without substantial evidence [5][6]. - These interventions target the semiconductor sector, aiming to block Chinese access to critical technologies and maintain Western technological dominance [6]. Group 4: Impact on Global Semiconductor Industry - The forced divestiture of HieFo's assets could disrupt global contracts and intellectual property, affecting technology development and production capacity [7]. - Similar actions in the ASML and FTDI cases have already led to significant disruptions in the global semiconductor supply chain, highlighting the potential for increased costs and inefficiencies across the industry [7]. Group 5: Conclusion on U.S. Strategy - The article concludes that the U.S. and its allies are employing overt technology protectionism under the guise of national security, aiming to stifle the development of China's semiconductor industry and preserve their technological hegemony [8][9]. - This trend poses risks for Chinese enterprises seeking overseas investments and could hinder global technological innovation and cooperation, ultimately harming collective interests [9].